X-On Electronics has gained recognition as a prominent supplier of ICE5LP2K-SWG36ITR50 FPGA - Field Programmable Gate Array across the USA, India, Europe, Australia, and various other global locations. ICE5LP2K-SWG36ITR50 FPGA - Field Programmable Gate Array are a product manufactured by Lattice. We provide cost-effective solutions for FPGA - Field Programmable Gate Array, ensuring timely deliveries around the world.

ICE5LP2K-SWG36ITR50 Lattice

ICE5LP2K-SWG36ITR50 electronic component of Lattice
ICE5LP2K-SWG36ITR50 Lattice
ICE5LP2K-SWG36ITR50 FPGA - Field Programmable Gate Array
ICE5LP2K-SWG36ITR50  Semiconductors

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See Product Specifications
Part No. ICE5LP2K-SWG36ITR50
Manufacturer: Lattice
Category: FPGA - Field Programmable Gate Array
Description: iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 2048 36-XFBGA, WLCSP
Datasheet: ICE5LP2K-SWG36ITR50 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
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1 : USD 5.5933
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100 : USD 3.4718
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We are delighted to provide the ICE5LP2K-SWG36ITR50 from our FPGA - Field Programmable Gate Array category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ICE5LP2K-SWG36ITR50 and other electronic components in the FPGA - Field Programmable Gate Array category and beyond.

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iCE40 Ultra Family Data Sheet FPGA-DS-02028-2.3 August 2018 iCE40 Ultra Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 5 1. General Description ...................................................................................................................................................... 6 1.1. Features ............................................................................................................................................................... 6 2. Product Family .............................................................................................................................................................. 7 2.1. Overview ............................................................................................................................................................. 7 3. Architecture .................................................................................................................................................................. 8 3.1. Architecture Overview ........................................................................................................................................ 8 3.1.1. PLB Blocks ....................................................................................................................................................... 9 3.1.2. Routing .......................................................................................................................................................... 10 3.1.3. Clock/Control Distribution Network ............................................................................................................. 10 3.1.4. sysCLOCK Phase Locked Loops (PLLs)............................................................................................................ 10 3.1.5. sysMEM Embedded Block RAM Memory ..................................................................................................... 12 3.1.6. sysDSP ........................................................................................................................................................... 14 3.1.7. sysIO Buffer Banks ........................................................................................................................................ 18 3.1.8. sysIO Buffer ................................................................................................................................................... 21 3.1.9. On-Chip Oscillator ......................................................................................................................................... 22 2 3.1.10. User I C IP ................................................................................................................................................. 22 3.1.11. User SPI IP ................................................................................................................................................. 22 3.1.12. High Current LED Drive I/O Pins ............................................................................................................... 22 3.1.13. Embedded PWM IP ................................................................................................................................... 23 3.1.14. Non-Volatile Configuration Memory ........................................................................................................ 23 3.2. iCE40 Ultra Programming and Configuration .................................................................................................... 24 3.2.1. Device Programming ..................................................................................................................................... 24 3.2.2. Device Configuration..................................................................................................................................... 24 3.2.3. Power Saving Options ................................................................................................................................... 24 4. DC and Switching Characteristics ................................................................................................................................ 25 4.1. Absolute Maximum Ratings .............................................................................................................................. 25 4.2. Recommended Operating Conditions ............................................................................................................... 25 4.3. Power Supply Ramp Rates ................................................................................................................................. 26 4.4. Power-On Reset ................................................................................................................................................ 26 4.5. Power-up Supply Sequence ............................................................................................................................... 26 4.6. External Reset ................................................................................................................................................... 26 4.7. Power-On-Reset Voltage Levels ........................................................................................................................ 27 4.8. ESD Performance ............................................................................................................................................... 28 4.9. DC Electrical Characteristics .............................................................................................................................. 28 4.10. Supply Current ................................................................................................................................................... 29 2 4.11. User I C Specifications ....................................................................................................................................... 29 4.12. User SPI Specifications ...................................................................................................................................... 30 4.13. Internal Oscillators (HFOSC, LFOSC) .................................................................................................................. 30 4.14. sysI/O Recommended Operating Conditions .................................................................................................... 30 4.15. sysI/O Single-Ended DC Electrical Characteristics ............................................................................................. 31 4.16. Differential Comparator Electrical Characteristics ............................................................................................ 31 4.17. Typical Building Block Function Performance ................................................................................................... 31 4.17.1. Pin-to-Pin Performance (LVCMOS25) ....................................................................................................... 31 4.17.2. Register-to-Register Performance ............................................................................................................ 32 4.18. Derating Logic Timing ........................................................................................................................................ 32 4.19. Maximum sysIO Buffer Performance ................................................................................................................ 32 4.20. iCE40 Ultra Family Timing Adders ..................................................................................................................... 33 4.21. iCE40 Ultra External Switching Characteristics.................................................................................................. 33 4.22. sysCLOCK PLL Timing ......................................................................................................................................... 34 4.23. sysDSP Timing .................................................................................................................................................... 35 4.24. SPI Master or NVCM Configuration Time .......................................................................................................... 35 2015-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02028-2.3

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
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