LFE2M35E-5FN256I Lattice

LFE2M35E-5FN256I electronic component of Lattice
LFE2M35E-5FN256I Lattice
LFE2M35E-5FN256I FPGA - Configuration Memory
LFE2M35E-5FN256I  Semiconductors
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X-On Electronics has gained recognition as a prominent supplier of LFE2M35E-5FN256I FPGA - Configuration Memory across the USA, India, Europe, Australia, and various other global locations. LFE2M35E-5FN256I FPGA - Configuration Memory are a product manufactured by Lattice. We provide cost-effective solutions for FPGA - Configuration Memory, ensuring timely deliveries around the world.

Part No. LFE2M35E-5FN256I
Manufacturer: Lattice
Category: FPGA - Configuration Memory
Description: FPGA LatticeECP2M Family 34000 Cells 90nm Technology 1.2V 256-Pin FBGA
Datasheet: LFE2M35E-5FN256I Datasheet (PDF)
Price (USD)
5: USD 289.9443 ea
Line Total: USD 1449.72 
Availability : 0
  
QtyUnit Price
5$ 289.9443

Availability 0
Ship by Tue. 11 Nov to Mon. 17 Nov
MOQ : 5
Multiples : 5
QtyUnit Price
5$ 289.9443

   
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We are delighted to provide the LFE2M35E-5FN256I from our FPGA - Configuration Memory category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LFE2M35E-5FN256I and other electronic components in the FPGA - Configuration Memory category and beyond.

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LatticeECP2/M Family Handbook HB1003 Version 05.3, February 2012 LatticeECP2/M Family Handbook Table of Contents February 2012 Section I. LatticeECP2/M Family Data Sheet Introduction Features ............................................................................................................................................................. 1-1 Introduction ........................................................................................................................................................ 1-2 Architecture Architecture Overview ........................................................................................................................................ 2-1 PFU Blocks ........................................................................................................................................................ 2-3 Slice .......................................................................................................................................................... 2-3 Modes of Operation................................................................................................................................... 2-5 Routing............................................................................................................................................................... 2-6 sysCLOCK Phase Locked Loops (GPLL/SPLL) ................................................................................................ 2-6 General Purpose PLL (GPLL)................................................................................................................... 2-6 Standard PLL (SPLL)................................................................................................................................ 2-7 Delay Locked Loops (DLL)................................................................................................................................. 2-8 DLLDELA Delay Block .............................................................................................................................. 2-9 PLL/DLL Cascading .................................................................................................................................. 2-9 GPLL/SPLL/GDLL PIO Input Pin Connections (LatticeECP2M Family Only) .................................................. 2-10 Clock Dividers .................................................................................................................................................. 2-10 Clock Distribution Network............................................................................................................................... 2-11 Primary Clock Sources............................................................................................................................ 2-11 Secondary Clock/Control Sources .......................................................................................................... 2-13 Edge Clock Sources................................................................................................................................ 2-14 Primary Clock Routing ............................................................................................................................ 2-15 Dynamic Clock Select (DCS) .................................................................................................................. 2-15 Secondary Clock/Control Routing........................................................................................................... 2-15 Slice Clock Selection............................................................................................................................... 2-17 Edge Clock Routing ................................................................................................................................ 2-18 sysMEM Memory ............................................................................................................................................. 2-19 sysMEM Memory Block........................................................................................................................... 2-19 Bus Size Matching .................................................................................................................................. 2-19 RAM Initialization and ROM Operation ................................................................................................... 2-19 Memory Cascading ................................................................................................................................. 2-19 Single, Dual and Pseudo-Dual Port Modes............................................................................................. 2-19 Memory Core Reset................................................................................................................................ 2-20 EBR Asynchronous Reset....................................................................................................................... 2-20 sysDSP Block ............................................................................................................................................... 2-21 sysDSP Block Approach Compared to General DSP ............................................................................. 2-21 sysDSP Block Capabilities...................................................................................................................... 2-21 MULT sysDSP Element .......................................................................................................................... 2-23 MAC sysDSP Element ............................................................................................................................ 2-24 MULTADDSUB sysDSP Element ........................................................................................................... 2-25 MULTADDSUBSUM sysDSP Element ................................................................................................... 2-26 Clock, Clock Enable and Reset Resources ............................................................................................ 2-26 Signed and Unsigned with Different Widths............................................................................................ 2-27 OVERFLOW Flag from MAC .................................................................................................................. 2-27 IPexpress............................................................................................................................................. 2-28 Optimized DSP Functions ................................................................................................................................ 2-28 Resources Available in the LatticeECP2/M Family.................................................................................2-28 2012 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 1

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LAT
LATTICE SEMI
Lattice Semiconductor
Lattice Semiconductor Corporation
Vantis
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