Product Information

LFXP3C3TN100C

LFXP3C3TN100C electronic component of Lattice

Datasheet
FPGA LatticeXP Family 3000 Cells 320MHz 130nm Technology 1.8V/2.5V/3.3V 100-Pin TQFP Tray

Manufacturer: Lattice
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5001: USD 92.7176 ea
Line Total: USD 463680.72

21032 - Global Stock
Ships to you between
Thu. 02 May to Wed. 08 May
MOQ: 5001  Multiples: 1
Pack Size: 1
Availability Price Quantity
20120 - Global Stock


Ships to you between Thu. 02 May to Wed. 08 May

MOQ : 5001
Multiples : 1
5001 : USD 52.1

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Operating Supply Voltage
Maximum Operating Temperature
Mounting Style
Packaging
Brand
Logic Cells
Frequency
Operating Temp Range
Package Type
Pin Count
Process Technology
Operating Temperature Min
Family Name
Operating Temperature Classification
Ram Bits
Programmable
I/Os Max
Number Of Logic Blocks/Elements
Rad Hardened
Operating Supply Voltage Min
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LatticeXP Family Data Sheet DS1001 Version 05.1, November 2007LatticeXP Family Data Sheet Introduction July 2007 Data Sheet DS1001 Flexible I/O Buffer Features Programmable sysIO buffer supports wide Non-volatile, Infinitely Reconfigurable range of interfaces: Instant-on powers up in microseconds LVCMOS 3.3/2.5/1.8/1.5/1.2 No external configuration memory LVTTL Excellent design security, no bit stream to SSTL 18 Class I intercept SSTL 3/2 Class I, II Reconfigure SRAM based logic in milliseconds HSTL15 Class I, III SRAM and non-volatile memory programmable HSTL 18 Class I, II, III through system configuration and JTAG ports PCI Sleep Mode LVDS, Bus-LVDS, LVPECL, RSDS Allows up to 1000x static current reduction Dedicated DDR Memory Support TransFR Reconfiguration (TFR) Implements interface up to DDR333 (166MHz) In-field logic update while system operates sysCLOCK PLLs Extensive Density and Package Options Up to 4 analog PLLs per device 3.1K to 19.7K LUT4s Clock multiply, divide and phase shifting 62 to 340 I/Os System Level Support Density migration supported IEEE Standard 1149.1 Boundary Scan, plus Embedded and Distributed Memory ispTRACY internal logic analyzer capability 54 Kbits to 396 Kbits sysMEM Embedded Onboard oscillator for configuration Block RAM Devices operate with 3.3V, 2.5V, 1.8V or 1.2V Up to 79 Kbits distributed RAM power supply Flexible memory resources: Distributed and block memory Table 1-1. LatticeXP Family Selection Guide Device LFXP3 LFXP6 LFXP10 LFXP15 LFXP20 PFU/PFF Rows 16 24 32 40 44 PFU/PFF Columns 2430384856 PFU/PFF (Total) 384 720 1216 1932 2464 LUTs (K) 3 6 101520 Distributed RAM (KBits) 1223396179 EBR SRAM (KBits) 54 72 216 324 396 EBR SRAM Blocks 6 8 24 36 44 V Voltage 1.2/1.8/2.5/3.3V 1.2/1.8/2.5/3.3V 1.2/1.8/2.5/3.3V 1.2/1.8/2.5/3.3V 1.2/1.8/2.5/3.3V CC PLLs 22444 Max. I/O 136 188 244 300 340 Packages and I/O Combinations: 100-pin TQFP (14 x 14 mm) 62 144-pin TQFP (20 x 20 mm) 100 100 208-pin PQFP (28 x 28 mm) 136 142 256-ball fpBGA (17 x 17 mm) 188 188 188 188 388-ball fpBGA (23 x 23 mm) 244 268 268 484-ball fpBGA (23 x 23 mm) 300 340 2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 1-1 DS1001 Introduction 01.5

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LA4
LAT
LATTICE SEMI
Lattice Semiconductor
Lattice Semiconductor Corporation
Vantis

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