X-On Electronics has gained recognition as a prominent supplier of LIA-MD6000-6KMG80E FPGA - Field Programmable Gate Array across the USA, India, Europe, Australia, and various other global locations. LIA-MD6000-6KMG80E FPGA - Field Programmable Gate Array are a product manufactured by Lattice. We provide cost-effective solutions for FPGA - Field Programmable Gate Array, ensuring timely deliveries around the world.

LIA-MD6000-6KMG80E Lattice

LIA-MD6000-6KMG80E electronic component of Lattice
LIA-MD6000-6KMG80E Lattice
LIA-MD6000-6KMG80E FPGA - Field Programmable Gate Array
LIA-MD6000-6KMG80E  Semiconductors

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See Product Specifications
Part No. LIA-MD6000-6KMG80E
Manufacturer: Lattice
Category: FPGA - Field Programmable Gate Array
Description: FPGA - Field Programmable Gate Array Auto Grade (AEC-Q100) Lattice CrossLink - Interface MIPI D-Phy Bridge
Datasheet: LIA-MD6000-6KMG80E Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 18.888 ea
Line Total: USD 18.89 
Availability - 190
Ship by Thu. 26 Jun to Mon. 30 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
190
Ship by Thu. 26 Jun to Mon. 30 Jun
MOQ : 1
Multiples : 1
1 : USD 18.888
25 : USD 15.873
100 : USD 15.29
1040 : USD 15.279
50180 : USD 15.268

   
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We are delighted to provide the LIA-MD6000-6KMG80E from our FPGA - Field Programmable Gate Array category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LIA-MD6000-6KMG80E and other electronic components in the FPGA - Field Programmable Gate Array category and beyond.

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CrossLink Automotive Family Data Sheet FPGA-DS-02013 Version 1.4 July 2018 CrossLink Automotive Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 5 1. General Description ...................................................................................................................................................... 6 1.1. Features ............................................................................................................................................................... 6 2. Product Feature Summary ............................................................................................................................................ 7 3. Architecture Overview .................................................................................................................................................. 8 3.1. MIPI D-PHY Blocks ............................................................................................................................................... 9 3.2. Programmable I/O Banks .................................................................................................................................. 13 3.3. sysI/O Buffers .................................................................................................................................................... 15 3.3.1. Programmable PULLMODE Settings ............................................................................................................. 15 3.3.2. Output Drive Strength ................................................................................................................................... 15 3.3.3. On-Chip Termination .................................................................................................................................... 15 3.4. Programmable FPGA Fabric .............................................................................................................................. 16 3.4.1. PFU Blocks ..................................................................................................................................................... 16 3.4.2. Slice ............................................................................................................................................................... 17 3.5. Clocking Structure ............................................................................................................................................. 20 3.5.1. sysCLK PLL ..................................................................................................................................................... 20 3.5.2. Primary Clocks ............................................................................................................................................... 21 3.5.3. Edge Clocks ................................................................................................................................................... 21 3.5.4. Dynamic Clock Enables ................................................................................................................................. 22 3.5.5. Internal Oscillator (OSCI) ............................................................................................................................... 22 3.6. Embedded Block RAM Overview ....................................................................................................................... 23 3.7. Power Management Unit .................................................................................................................................. 24 3.7.1. PMU State Machine ...................................................................................................................................... 24 2 3.8. User I C IP .......................................................................................................................................................... 25 3.9. Programming and Configuration ....................................................................................................................... 26 4. DC and Switching Characteristics ................................................................................................................................ 27 4.1. Absolute Maximum Ratings .............................................................................................................................. 27 4.2. Recommended Operating Conditions ............................................................................................................... 27 4.3. Power Supply Ramp Rates ................................................................................................................................. 28 4.4. Power-On-Reset Voltage Levels ........................................................................................................................ 28 4.5. ESD Performance ............................................................................................................................................... 28 4.6. DC Electrical Characteristics .............................................................................................................................. 29 4.7. CrossLink Automotive Supply Current............................................................................................................... 30 4.8. Power Management Unit (PMU) Timing ........................................................................................................... 31 4.9. sysI/O Recommended Operating Conditions .................................................................................................... 31 4.10. sysI/O Single-Ended DC Electrical Characteristics ............................................................................................. 31 4.11. sysI/O Differential Electrical Characteristics ..................................................................................................... 32 4.11.1. LVDS/subLVDS/SLVS200 ........................................................................................................................... 32 4.11.2. Hardened MIPI D-PHY I/Os ....................................................................................................................... 33 4.12. CrossLink Automotive Maximum General Purpose I/O Buffer Speed ............................................................... 34 4.13. CrossLink Automotive External Switching Characteristics ................................................................................ 35 4.14. sysCLOCK PLL Timing ......................................................................................................................................... 40 4.15. Hardened MIPI D-PHY Performance.................................................................................................................. 41 4.16. Internal Oscillators (HFOSC, LFOSC) .................................................................................................................. 41 2 1 4.17. User I C ............................................................................................................................................................. 41 4.18. CrossLink Automotive sysCONFIG Port Timing Specifications .......................................................................... 42 4.19. SRAM Configuration Time from NVCM ............................................................................................................. 42 4.20. Switching Test Conditions ................................................................................................................................. 43 5. Pinout Information ..................................................................................................................................................... 44 5.1. ctfBGA80/cktBGA80 Pinout ............................................................................................................................... 44 5.2. csfBGA81 Pinout ................................................................................................................................................ 46 5.3. Dual Function Pin Descriptions ......................................................................................................................... 48 2015-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02013-1.4

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
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