Product Information

SMG236354R-0.315

SMG236354R-0.315 electronic component of LeaderTech

Datasheet
EMI Gaskets, Sheets, Absorbers & Shielding 6H x 9W x 8L mm HIGH TEMP SIL SPONG

Manufacturer: LeaderTech
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

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SMG236354R-0.315
LeaderTech

1 : USD 3.1133
25 : USD 1.2117
50 : USD 1.178
1200 : USD 0.4701
2400 : USD 0.4544
4800 : USD 0.4409
N/A

Obsolete
     
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RoHS - XON
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00432 Product Profile Applications Mobile Electronics Computers Integrated Circuits Surface Mount Gaskets and Grounding Pads Our SMG gaskets can be used with many different types of board level shielding needs and when grounding Benefits points are required on your board. Form-in-Place gaskets can be eliminated by transferring the gasket to the board rather than to the thin edge of a casting or machined housing. No fear of damaging a thin Form-in- Low Cost Place gasket during handling and assembly process. High speed SMT assembly of our tape and reel supplied gaskets make this a low cost reliable assembly option. Suitable for Automated Sizes Packaging Cross Section Placement Part Numbers Core Materials (parts per reel) (not to scale) Height Width Length Tape & Reel Packaging Hollow High Temp. SMG098118R-0.098 0.098 2.5 0.118 3 0.098 2.5 2100 Sil. Sponge Off-The-Shelf Hollow High Temp. Reflow Capabilities SMG118118R-0.079 0.118 3 0.118 3 0.079 2 1800 Sil. Sponge Low Compression Solid High Temp. Requirements SMG118118R-0.118 0.118 3 0.118 3 0.118 3 1800 Foam Resilient Hollow High Temp. SMG118157R-0.197 0.118 3 0.157 4 0.197 5 1800 Sil. Sponge Material Solid High SMG118197R-0.256 0.118 3 0.197 5 0.256 7 1500 Temp. Foam Outer Wrap Polyimide coated Sn/Cu Solid High SMG256197R-0.118 0.256 6.5 0.197 5 0.118 3 1100 Temp. Foam Hollow High Temp. SMG157256R-0.276 0.157 4 0.256 6.5 0.276 7 1200 Sil. Sponge Hollow High Temp. SMG236295R-0.157 0.236 6 0.295 7.5 0.157 4 1200 Sil. Sponge Hollow High Temp. SMG236354R-0.315 0.236 6 0.354 9 0.315 8 600 Sil. Sponge Hollow High Temp. SMGEA SMG295197R-0.138 0.295 7.5 0.197 5 0.138 3.5 1000 Sil. Sponge Surface Black = inches Blue = mm Tolerance: +/- .019 (.48mm) mount gaskets Global EMI Shielding Technology Center www.LeaderTechInc.com 12420 Race Track Rd., Tampa, Florida 33626 866.TECH.EMI (866.832.4364) t 813.855.6921 f 813.855.3291 STATEMENT OF LIEU OF WARRANTY: All technical information and data in this document is based on tests and is believed to be accurate and reliable. Nevertheless, since the products described herein are not provided to conform with mutually accepted specifications and the use thereof is unknown, the manufacturer and seller of the products do not guarantee results, freedom from patent infringement, or suitability of the products for any application thereof. The manufacturer and seller of the products described in this document will provide all possible technical assistance and will replace any products proven defective. No statement or recommendations made by the manufacturer or seller not contained herein shall have any force of effect unless in conformity with an agreement signed by an officer of the seller and manufacturer. Product testing by the purchaser is recommended in order to confirm expected results. Copyright Leader Tech, Inc. 2017 00432 Product Profile Surface Mount Gaskets and Grounding Pads Method Property Silicone Sponge Polyurethane Foam Applications Outer Material - Polyimide coated Sn/Cu Polyimide coated Sn/Cu Color - Silver Silver Mobile Electronics Surface Resistance ASTM D257 < 0.05 Ohm/in < 0.05 Ohm/in Computers Hardness of Silicone ASTM D2240 60 (Shore A) 20 (Shore C) Integrated Circuits Deformation % ASTM D5947 260C, 30min 10% 10% 150C, 100hrs, ASTM D374 95% 85% Benefits 20% compression -40C, 100hrs, ASTM D374 Low Cost 20% compression Resilience Ratio 85C, 85% Rel. Humidity, 100hrs, 95% 95% ASTM D374 Suitable for Automated 20% compression Placement ASTM D374 300 cycles, 20% compression Tape & Reel Packaging Surface Mount Gasket - Force vs. Compression Off-The-Shelf 10.00 Reflow Capabilities 9.00 Low Compression Requirements 8.00 Resilient 7.00 6.00 Material 5.00 Outer Wrap Polyimide coated Sn/Cu 4.00 3.00 2.00 1.00 0.00 0.300 0.275 0.250 0.225 0.200 0.175 0.150 0.125 0.100 0.075 0.050 0.025 0.000 Gasket Height (inches) SMG098118R-0.098 SMG118118R-0.079 SMG118118R-0.118 SMG118157R-0.197 SMG118197R-0.256 SMGEA SMG157256R-0.276 SMG236295R-0.157 SMG236354R-0.315 SMG256197R-0.118 SMG295197R-0.138 Surface mount gaskets Global EMI Shielding Technology Center www.LeaderTechInc.com 12420 Race Track Rd., Tampa, Florida 33626 866.TECH.EMI (866.832.4364) t 813.855.6921 f 813.855.3291 STATEMENT OF LIEU OF WARRANTY: All technical information and data in this document is based on tests and is believed to be accurate and reliable. Nevertheless, since the products described herein are not provided to conform with mutually accepted specifications and the use thereof is unknown, the manufacturer and seller of the products do not guarantee results, freedom from patent infringement, or suitability of the products for any application thereof. The manufacturer and seller of the products described in this document will provide all possible technical assistance and will replace any products proven defective. No statement or recommendations made by the manufacturer or seller not contained herein shall have any force of effect unless in conformity with an agreement signed by an officer of the seller and manufacturer. Product testing by the purchaser is recommended in order to confirm expected results. Copyright Leader Tech, Inc. 2017 Force (lb)

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
LEADER
Leader Tech
LEADER TECH-FERRISHIELD

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