IllumInatIon luXEon 5050 High ecffi acy and superior robustness in a multi-die, high power package, enabling cost-eeff ctive system design LUXEON 5050 is a multi-die, high power package that provides high luminance from a super robust package to enable cost effective, single optic and directional fixture designs. LUXEON 5050 uses an industry standard 5050 surface mount package with a small Light Emitting Surface (LES). LUXEON 5050 comes in 70CRI, 80CRI and 90CRI with a wide range of CCTs, and offers hot-color targeting to ensure that the LEDs are within color target at application conditions of 85C. FEaturEs and BEnEFIts PrImary aPPlIcatIons Superior lm/W enables outstanding efficacy in end application High Bay 1 Extremely reliable package design affirms long lifetime in harsh environments Low Bay Two voltage configurations are compatible with low cost high efficacy drivers Floodlights Low R enables effective thermal dissipation design for higher efficiency Wall Pack th Hot-color targeting ensures color is within ANSI bin at 85C More 3-step and 5-step MacAdam ellipse binning structure ensures excellent color uniformity 1. Refer to reliability datasheet for more details. No. E507562 DS174 LUXEON 5050 Product Datasheet 2020 Lumileds Holding B.V. All rights reserved.Table of Contents General Product Information 2 Product Test Conditions...................... 2 Part Number Nomenclature .................... 2 Lumen Maintenance ....................... 2 Environmental Compliance ..................... 2 Performance Characteristics 3 Product Selection Guide...................... 3 Optical Characteristics ....................... 5 Electrical and Thermal Characteristics.................... 5 Absolute Maximum Ratings . 5 Characteristic Curves . 6 Spectral Power Distribution Characteristics ................. 6 Light Output Characteristics .................... 7 Forward Current Characteristics..................... 9 Radiation Pattern Characteristics ................... 11 Product Bin and Labeling Definitions 12 Decoding Product Bin Labeling..................... 12 Luminous Flux Bins ....................... 13 Color Bin Definitions ........................ 14 Forward Voltage Bins ..................... 15 Mechanical Dimensions 16 Reflow Soldering Guidelines 17 JEDEC Moisture Sensitivity ....................... 17 Solder Pad Design ........................ 18 Packaging Information . 18 Pocket Tape Dimensions ...................... 18 Reel Dimensions ......................... 19 DS174 LUXEON 5050 Product Datasheet 20200721 2020 Lumileds Holding B.V. All rights reserved. i