IllumInatIon luX eon csP Hl1 High current density Chip Scale Package (CSP) LED LUXEON CSP HL1 LEDs offer high flux density performance in a compact footprint, enabling elegant and superior luminaire designs. A wide range of CCTs in 80 and 90CRI options make them ideal for high performance indoor lighting applications, designed into tunable and white color mixing solutions. Best-in-class Color over Angle, and top emission only light output, provides designers with leading Quality of Light performance for dramatic lighting designs and small fixtures. The compact package size and high punch allows design flexibility, beam steering, and white tuning versus traditional LED light sources. Features and BeneFIts PrImary aPPlIcatIons Small package size (1.4 x 1.4 x 0.3mm) allows closely packed arrays Panel / Soft Lights for narrow beam spots Enables color mixing in CCT tunable applications Wall Grazer High current densities for high lumen output and lm/ at high lm/W Track Lights 2 CSP 1mm with 2 pads for direct attach enables ease of assembly Linear Surface emission only for directional lighting without side light leakage Wall Wash High package densities Downlights No. E352519 DS186 LUXEON CSP HL1 Product Datasheet 2021 Lumileds Holding B.V. All rights reserved.Table of Contents General Product Information 2 Product Test Conditions...................... 2 Part Number Nomenclature .................... 2 Lumen Maintenance ....................... 2 Environmental Compliance ..................... 2 Performance Characteristics 3 Product Selection Guide...................... 3 Optical Characteristics ....................... 3 Electrical and Thermal Characteristics.................... 3 Absolute Maximum Ratings . 4 Characteristic Curves . 4 Spectral Power Distribution Characteristics ................. 4 Light Output Characteristics .................... 5 Forward Current Characteristics..................... 6 Radiation Pattern Characteristics .................... 7 Product Bin and Labeling Definitions . 8 Decoding Product Bin Labeling.................... 8 Luminous Flux Bins ........................ 8 Color Bin Definitions ....................... 9 Forward Voltage Bins ..................... 10 Mechanical Dimensions 10 Reflow Soldering Guidelines 11 JEDEC Moisture Sensitivity ....................... 11 Solder Pad Design ........................ 12 Packaging Information . 13 Pocket Tape Dimensions ...................... 13 Reel Dimensions ......................... 14 DS186 LUXEON CSP HL1 Product Datasheet 20210101 2021 Lumileds Holding B.V. All rights reserved. i