Product Information

MA4P7446F-1091T

MA4P7446F-1091T electronic component of MACOM

Datasheet
MACOM PIN Diodes Rs=.5ohm Ct=2.2pF non-Mag MELF

Manufacturer: MACOM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 23.0805 ea
Line Total: USD 23.08

386 - Global Stock
Ships to you between
Thu. 09 May to Mon. 13 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
386 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1
1 : USD 23.0805
10 : USD 21.6545
25 : USD 20.677
50 : USD 20.5505
100 : USD 19.0095
250 : USD 18.124
500 : USD 17.825
1000 : USD 17.825

11640 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 500
Multiples : 500
500 : USD 19

14550 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 500
Multiples : 500
500 : USD 18.3125

291 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 4
Multiples : 1
4 : USD 35.1875

     
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MA4P7446F-1091T Non Magnetic SMQ MELF PIN Diode Rev. V4 Features Non-Magnetic Package Suitable for MRI Applications Rectangular MELF SMQ Ceramic Package Hermetically Sealed Low Rs for Low Series Loss Long for Lower Intermodulation Distortion L Low C for High Series Isolation j High Average Incident Power Handling RoHS Compliant Description The MA4P7446F-1091T is a surface mountable PIN diode in a non-magnetic, Metal Electrode Leadless Faced (MELF) package. The device in- corporates M/A-COM Technology Solutions time Designed for Automated Assembly proven HIPAX technology to produce a low induc- tance ceramic package with no ribbons or whisker These SMQ PIN diodes are designed for high wires. Incorporated in the package is a hard glass volume tape and reel assembly. The rectangular passivated, CERMACHIP PIN chip that is full package design provides for highly efficient face bonded on both the cathode and anode to automatic pick and place assembly techniques. The maximize surface area for the lowest electrical and parallel flat surfaces are suitable for key jaw or thermal resistance. The package utilizes a non- vacuum pickup. All solderable surfaces are tin plated magnetic plating process that provides for a pack- and compatible with industry standard reflow and age with extremely low permeability. The vapor phase soldering methods. MA4P7446F-1091T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. 1 The non-magnetic MA4P7446F-1091T is the elec- Absolute Maximum Ratings 25C trical equivalent of its magnetic counterpart the MA4P4006F-1091T. Parameter Absolute Maximum Operating Temperature -65C to +125C Applications Storage Temperature -65C to +150C This diode is well suited for use in low loss, low distortion, high power switching circuits and can Diode Junction Temperature +175 C Continuous be used in high magnetic field environments at HF through UHF frequencies. The low thermal resis- Diode Mounting Temperature +235C for 10 seconds tance of this device provides excellent perform- RF C.W. Incident Power + 57dBm C.W. ance at high RF power incident levels, up to 500 watts CW. This device is designed to meet the Forward D.C. Current +500 mA most demanding electrical and mechanical MRI Reverse D.C. Voltage -10 uA - 600V environments. 1. Exceeding these limits may cause permanent damage. 1 11 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MA4P7446F-1091T Non Magnetic SMQ MELF PIN Diode Rev. V4 Electrical Specifications T = +25C AMBIENT Parameter Symbol Condition Unit Value Forward Voltage V I = +100mA 1.0 V (Max.) F F DC Reverse Voltage V I = -1A 600V (Min.) R R DC Total Capacitance C -100V 1MHz 2.2pF (Max.) T Series Resistance R +100mA 100MHz 0.5 (Max) S Parallel Resistance R -10V 100MHz 10K (Min.) P I = +6mA , I = -10mA F R Carrier Lifetime t 19s (Typ.) L (50% - 90% Voltage) I-Region Length M 175M (Typ.) I = 1A, I = 10mA, HIGH LOW C.W. Thermal Resistance 6C/W (Max.) T = 1mS Power Dissipation in Free Air W I = +100mA 8W (Max.) F Power Dissipation P I = +100mA 25W (Max.) DISS F Environmental Capability MELF devices are appropriate for use in industrial and military applications and can be screened to meet the environmental requirements of MIL-STD-750, MIL-STD-202 as well as other military standards. The table below lists some of the MIL-STD 750 tests the device is designed to meet. MIL-STD-750 Test Method Description High Temperature Storage 1031 +150C, for 340 Hours Temperature Shock 1051 -65C to +150C, 20 Cycles HTRB 1038 80% of rated V , +150C, for 96 Hours B Moisture Resistance 1021 No Initial Conditioning, 85% RH, +85C Gross Leak 1071 Cond. E Dye Penetrant Visual Vibration Fatigue 2046 20,000Gs, 60Hz, x, y, z axis Solderability 2026 Test Temperature = +245C 2 22 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit:

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Aeroflex / Metelics (MACOM)
Aeroflex Metelics
M/A-COM
M/A-COM / TYCO
M/A-COM Technology Solutions
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Nitronex

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