Product Information

MAMX-011036-DIE

MAMX-011036-DIE electronic component of MACOM

Datasheet
RF Mixer Die,Mixer,Dbl Bal,8-43 GHz

Manufacturer: MACOM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

10: USD 238.8397 ea
Line Total: USD 2388.4

67 - Global Stock
Ships to you between
Fri. 03 May to Thu. 09 May
MOQ: 10  Multiples: 10
Pack Size: 10
Availability Price Quantity
58 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 10
Multiples : 10
10 : USD 131.6437

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Conversion Loss - Max
Maximum Operating Temperature
Minimum Operating Temperature
Mounting Style
Package / Case
RF Frequency
LO Frequency
IF Frequency
Brand
Development Kit
Hts Code
Oip3 - Third Order Intercept
P1db - Compression Point
Product Type
Factory Pack Quantity :
Subcategory
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MAMX-011036-DIE Double-Balanced Mixer Rev. V1 8 to 43 GHz Features Functional Schematic Low Conversion Loss: 8 dB High Linearity: 22 dBm IIP3 Wide IF Bandwidth: DC to 10 GHz 1 9 High Isolation LO RF Die Size: 1.20 0.97 0.10 mm RoHS* Compliant 2 8 Description MAMX-011036-DIE is a double-balanced passive 3 7 IF diode mixer MMIC. The mixer offers low conversion loss, high linearity and a wide IF bandwidth. The double-balanced circuit configuration provides 4 5 6 excellent port isolation while internal 50-ohm matching simplifies its application. This mixer is well suited for applications such as test and measurement, microwave radio and radar. MAMX-011036-DIE is also available in a 3 mm QFN Bond-pad Configuration package. Refer to datasheet MAMX-011036. Pad No. Function Pad No. Function 2 2 1 GND 6 GND 2 Ordering Information 2 LO 7 GND 2 Part Number Package 3 GND 8 RF 1 2 2 MAMX-011036-DIE Vacuum Release Gel Pack 4 GND 9 GND 3 MAMX-011036-SB2 Sample Board 5 IF 10 GND 1. Die quantity varies. 2. These pads are internally connected to ground, and they can be left unconnected. 3. The backside of the die must be connected to RF, DC and thermal ground. * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. 11 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MAMX-011036-DIE Double-Balanced Mixer Rev. V1 8 to 43 GHz 4 Electrical Specifications : F = 500 MHz, P = +15 dBm, T = 25C, Z = 50 IF LO A 0 Parameter Test Conditions Units Min. Typ. Max. LO and RF Frequency GHz 8 43 IF Frequency GHz 0 10 LO Power dBm 15 8 - 20 GHz 8 10 Conversion Loss 20 - 34 GHz dB 8 11 34 - 43 GHz 9 13 Input P1dB dBm 13 Input IP3 P = -10 dBm/tone, f = 1 MHz dBm 22 RF Input IP2 P = -10 dBm/tone, f = 1 MHz dBm 45 RF LO-to-RF Isolation dB 40 8 - 20 GHz 26 40 LO-to-IF Isolation 20 - 34 GHz dB 14 33 34 - 43 GHz 20 50 8 - 20 GHz - 9 RF-to-IF Isolation 20 - 34 GHz dB - 25 34 - 43 GHz 23 38 RF Return Loss RF = 15 GHz dB 5 IF Return Loss IF = 500 MHz dB 15 4. All specifications refer to down-conversion operation, unless otherwise noted. 5,6 Handling Procedures Absolute Maximum Ratings Please observe the following precautions to avoid Parameter Absolute Maximum damage: LO Power 23 dBm Static Sensitivity These electronic devices are sensitive to RF or IF Power 20 dBm electrostatic discharge (ESD) and can be damaged 7 by static electricity. Proper ESD control techniques Junction Temperature +150C should be used when handling these HBM Class 1B devices. Operating Temperature -55C to +85C Storage Temperature -65C to +150C 5. Exceeding any one or combination of these limits may cause permanent damage to this device. 6. MACOM does not recommend sustained operation near these survivability limits. 7. Operating at nominal conditions with T +150C will ensure J 6 MTTF > 1 x 10 hours. 22 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit:

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Aeroflex / Metelics (MACOM)
Aeroflex Metelics
M/A-COM
M/A-COM / TYCO
M/A-COM Technology Solutions
MA/COM
MACOM
Nitronex

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