MAT10040

MAT10xxx Series Attenuator DIE Rev. V4 DC - 20 GHz Features Medium Power Handling 2 W CW Flat Response from DC to 20 GHz Return Loss: >18 dB DC to 12 GHz >16 dB 13 to 20 GHz Space Saving Footprint: 0.030 x 0.030 (0.762 x 0.762 mm) Front to back metallization in 4 places Very Good Stability Over Temperature (TRC <100 PPM) Ground Wrap to Top (No ground bonding required) RoHS* Compliant Description These fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a Bonding pad sizes and resistor outline may differ from value to value. metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground bonding ribbon is not required. The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable. Custom values and configuration available on request. Electrical Specifications: T = +25C A Part Number Attenuation (dB) Insertion Loss (dB) Return Loss (dB) MAT10010 1 +/-0.30 >18 MAT10020 2 +/-0.30 >18 MAT10030 3 +/-0.30 >18 MAT10040 4 +/-0.30 >18 MAT10050 5 +/-0.30 >18 MAT10060 6 +/-0.35 >18 MAT10070 7 +/-0.35 >18 MAT10080 8 +/-0.35 >18 CONTINUED * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. 11 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MAT10xxx Series Attenuator DIE Rev. V4 DC - 20 GHz Electrical Specifications: T = +25C A Part Number Attenuation (dB) Insertion Loss (dB) Return Loss (dB) MAT10090 9 +/-0.35 >18 MAT10100 10 +/-0.35 >18 MAT10110 11 +/-0.40 >18 MAT10120 12 +/-0.40 >18 MAT10130 13 +/-0.40 >18 MAT10140 14 +/-0.40 >18 MAT10150 15 +/-0.40 >18 MAT10160 16 +/-0.50 >18 MAT10170 17 +/-0.50 >18 MAT10180 18 +/-0.50 >18 MAT10190 19 +/-0.50 >18 MAT10200 20 +/-0.50 >18 MAT10210 21 +/-0.60 >18 MAT10220 22 +/-0.60 >18 MAT10230 23 +/-0.60 >18 MAT10240 24 +/-0.60 >18 MAT10250 25 +/-0.60 >18 MAT10260 26 +/-1.00 >18 MAT10270 27 +/-1.00 >18 MAT10280 28 +/-1.00 >18 MAT10290 29 +/-1.00 >18 MAT10300 30 +/-1.00 >18 1,2 Absolute Maximum Ratings Parameter Absolute Maximum RF Incident Power 33 dBm Operating Temperature -55C to +150C Storage Temperature -65C to +150C Assembly Temperature +280C for 10 seconds 1. Exceeding any one or combination of these limits may cause permanent damage to this device. 2. MACOM does not recommend sustained operation near these survivability limits. 22 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: