X-On Electronics has gained recognition as a prominent supplier of MX25L6433FZ2I-08G across the USA, India, Europe, Australia, and various other global locations. MX25L6433FZ2I-08G are a product manufactured by Macronix. We provide cost-effective solutions for MX25L6433FZ2I-08G, ensuring timely deliveries around the world.

MX25L6433FZ2I-08G Macronix

MX25L6433FZ2I-08G electronic component of Macronix
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See Product Specifications
Part No. MX25L6433FZ2I-08G
Manufacturer: Macronix
Category: Unclassified
Description: CMOS MXSMIO (Serial Multi I/O) Flash Memory 64Mb Capacity 64M x 1/32M x 2/16M x 4 Organization 133MHz Speed 3V Supply Voltage Surface Mount 8-Pin WSON Tray
Datasheet: MX25L6433FZ2I-08G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
4800: USD 1.0934 ea
Line Total: USD 5248.32 
Availability - 0
MOQ: 4800  Multiples: 4800
Pack Size: 4800
Availability Price Quantity
0
Ship by Thu. 15 May to Wed. 21 May
MOQ : 4800
Multiples : 4800
4800 : USD 1.0934

   
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We are delighted to provide the MX25L6433FZ2I-08G from our Macronix manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25L6433FZ2I-08G and other electronic components in the Macronix manufacturer and beyond.

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MX25L6433F MX25L6433F 3V, 64M-BIT [x 1/x 2/x 4] CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY Key Features Hold Feature Multi I/O Support - Single I/O, Dual I/O and Quad I/O Auto Erase and Auto Program Algorithms Program Suspend/Resume & Erase Suspend/Resume P/N: PM2130 Rev. 1.6, October 21, 2016 1MX25L6433F Contents 1. FEATURES ........................................................................................................................................................ 5 2. GENERAL DESCRIPTION ............................................................................................................................... 6 3. PIN CONFIGURATION ...................................................................................................................................... 7 4. PIN DESCRIPTION ............................................................................................................................................ 7 5. BLOCK DIAGRAM ............................................................................................................................................. 8 6. DATA PROTECTION .......................................................................................................................................... 9 Table 1. Protected Area Sizes ..............................................................................................................10 Table 2. 8K-bit Secured OTP Definition ............................................................................................... 11 7. MEMORY ORGANIZATION ............................................................................................................................. 12 Table 3. Memory Organization .............................................................................................................12 8. DEVICE OPERATION ...................................................................................................................................... 13 9. HOLD FEATURE .............................................................................................................................................. 14 10. COMMAND DESCRIPTION ........................................................................................................................... 15 Table 4. Command Sets .......................................................................................................................15 10-1. Write Enable (WREN) ..........................................................................................................................18 10-2. Write Disable (WRDI) ...........................................................................................................................19 10-3. Read Identification (RDID) ...................................................................................................................20 10-4. Read Status Register (RDSR) .............................................................................................................21 10-5. Read Configuration Register (RDCR) ..................................................................................................22 Table 5. Status Register .......................................................................................................................23 Table 6. Configuration Register ............................................................................................................24 Table 7. Dummy Cycle and Frequency Table .......................................................................................24 10-6. Write Status Register (WRSR) .............................................................................................................25 Table 8. Protection Modes ....................................................................................................................26 10-7. Read Data Bytes (READ) ....................................................................................................................28 10-8. Read Data Bytes at Higher Speed (FAST_READ) ..............................................................................29 10-9. Dual Read Mode (DREAD) ..................................................................................................................30 10-10. 2 x I/O Read Mode (2READ) ...............................................................................................................31 10-11. Quad Read Mode (QREAD) ................................................................................................................32 10-12. 4 x I/O Read Mode (4READ) ...............................................................................................................33 10-13. Performance Enhance Mode ...............................................................................................................35 10-14. Burst Read ...........................................................................................................................................36 10-15. Sector Erase (SE) ................................................................................................................................37 10-16. Block Erase (BE) .................................................................................................................................38 10-17. Block Erase (BE32K) ...........................................................................................................................39 10-18. Chip Erase (CE) ...................................................................................................................................40 10-19. Page Program (PP) .............................................................................................................................41 10-20. 4 x I/O Page Program (4PP) ................................................................................................................42 10-21. Deep Power-down (DP) .......................................................................................................................45 10-22. Release from Deep Power-down (RDP), Read Electronic Signature (RES) .......................................46 10-23. Read Electronic Manufacturer ID & Device ID (REMS) .......................................................................48 Table 9. ID Definitions .........................................................................................................................49 10-24. Enter Secured OTP (ENSO) ................................................................................................................49 P/N: PM2130 Rev. 1.6, October 21, 2016 2

Tariff Desc

8523510000
Macronix International
MX7
MXA
MXIC(Macronix)
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