CMBA023737 Series Model : BGA Heat Sink For 37.5x37.5 Chip set Specification CMBA023737 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base (thickness) : 2.6mm 3.Finish: Black Anodize 4.Chip set package thickness and clip color 3.3+/-0.25mm - Yellow clip 1.7+/-0.25mm - Blue clip 0.8+/-0.25mm - Orange clip 5.Accessory : Clip : Plastic (UL94-V0) Thermal pad : T710 or others Performance Heat Source (LxW) 15x15 3.5 0.35 3.0 0.30 H=25 2.5 0.25 H=20 2.0 0.20 1.5 0.15 H=12 1.0 0.10 H=25 0.5 0.05 0.0 0.00 0 100 200 300 400 500 600 700 800 Air Velocity (LFM) No.5, Ming Lung Road ,Yang Mei , Taiwan 32663 website : X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for malico manufacturer: Other Similar products are found below : MBH30001-13L/2.0 CMBA024949 MBH375002-12P/2.6 CEBF0145451601-00 CL-Y-35X35 MBH42.5002-12P/2.6