4860P-35G

Sn63/Pb37 No Clean Solder Paste 4860P Technical Data Sheet 4860P Description The MG 4860P No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method. The post soldering residues of 4860P are non-conductive, non- corrosive and highly insulated. Benefits Low residues Easily dispensed Excellent wettability Hard non-conductive residues Solder Composition of MG 4860P Solder Paste Sn63 alloy is the conventional eutectic solder used in most electronic assemblies. The Sn63 alloy conforms and exceeds the impurity requirements of J-STD-006 and all other relevant international standards. Typical Analysis Sn Pb Cu Ag Sb Bi In As Fe Ni Cd Al Zn Au 62.5- Bal. 0.030 0.020 0.050 0.050 0.050 0.010 0.010 0.005 0.001 0.001 0.001 0.002 63.5 Max Max Max Max Max Max Max Max Max Max Max Max Particle Size Sn63 alloy is 3( 45-25m and J -STD-005 powder distribution. Solder powder distribution is measured utilizing laser diffraction, optical analysis and sieve analysis. Careful control of solder powder manufacturing processes ensures the particles shape are 95% spherical minimum (aspect ratio < 1.5) and that the alloy contains a typical maximum oxide level of 80 ppm. Classification of Solder Powder by Particle Size Powder Type Fines Majority Coarse Typical Mesh <10% >80% >90% <1% 0% 3 20 25-45 45 50 325/500 Metal Loading Typical metal loading for dispensing application is 87.0-88.0 %. Page 1 of 6 Rev. Date: 25 August 2014 / Ver. 1.10Sn63/Pb37 No Clean Solder Paste 4860P Technical Data Sheet 4860P Properties MG 4860P Sn63/Pb37 Melting Point, C 183 E Hardness, Brinell 14HB Coefficient of Thermal Expansion 24.7 Tensile Strength, psi 4442 Density, g/cc 8.42 Electrical Resistivity , (o hm - cm) 14.5 Electrical Conductivity, 104/ohm-cm 6.9 Yield Strength, psi 3950 Total Elongation,% 48 Joint Shear Strength, at 0.1mm/min 20 C 23 Joint Shear Strength, at 0.1mm/min 100 C 14 Creep Strength, N/mm2 at 0.1mm/min 20 C 3.3 Property Specification Test Method Flux Classification REL0 JSTD-004 Copper Mirror No removal of copper film IPC-TM-650 2.3.32 Corrosion Pass IPC-TM-650 2.6.15 SIR JSTD-004 2.44 x 1010 ohms IPC-TM-650 2.6.3.3 Bellcore (Telecordia) 4.10 x 1010 ohms Bellcore GR-78-CORE 13.1.3 Electromigration Pass Bellcore GR-78-CORE 13.1.4 Post Reflow Flux Residue 45% TGA Analysis Acid Value 110 IPC-TM-650 2.3.13 Metal Loading 88% IPC-TM-650 2.2.20 Viscosity Brookfield (1), kcps 400+/-10% kcps IPC-TM-650 2.4.34 modified Malcom (2), poise 850-1100 IPC-TM-650 2.4.34.3 modified Slump Test 25 C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35 150 C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35 25 C, 0.33 vertical/horizontal 0.20 /0.20 IPC-TM-650 2.4.35 150 C, 0.33 vertical/horizontal 0.20/0.20 IPC-TM-650 2.4.35 Solder Ball Test Pass IPC-TM-650 2.4.43 Tack Initial 85 gm JIS Z 3284 Tack retention @ 24 hr 90 gm JIS Z 3284 Tack retention @ 24 hr 82 gm JIS Z 3284 Page 2 of 6 Rev. Date: 25 August 2014 / Ver. 1.10