X-On Electronics has gained recognition as a prominent supplier of A3P600L-FGG144 FPGA - Field Programmable Gate Array across the USA, India, Europe, Australia, and various other global locations. A3P600L-FGG144 FPGA - Field Programmable Gate Array are a product manufactured by Microchip. We provide cost-effective solutions for FPGA - Field Programmable Gate Array, ensuring timely deliveries around the world.

A3P600L-FGG144 Microchip

A3P600L-FGG144 electronic component of Microchip
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Part No.A3P600L-FGG144
Manufacturer: Microchip
Category: FPGA - Field Programmable Gate Array
Description: FPGA - Field Programmable Gate Array ProASIC3
Datasheet: A3P600L-FGG144 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 65.8009 ea
Line Total: USD 65.8 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 07 Nov to Wed. 13 Nov
MOQ : 1
Multiples : 1
1 : USD 65.8009
25 : USD 39.4791
100 : USD 31.59
500 : USD 28.7151
1000 : USD 27.8794

   
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We are delighted to provide the A3P600L-FGG144 from our FPGA - Field Programmable Gate Array category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the A3P600L-FGG144 and other electronic components in the FPGA - Field Programmable Gate Array category and beyond.

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Revision 3 Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology Architecture Supports Ultra-High Utilization Features and Benefits Advanced and Pro (Professional) I/Os Military Temperature Tested and Qualified 700 Mbps DDR, LVDS-Capable I/Os Each Device Tested from 55C to 125C 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation Bank-Selectable I/O Voltagesup to 8 Banks per Chip Firm-Error Immune Single-Ended I/O Standards: LVTTL, LVCMOS 3.3V/ Not Susceptible to Neutron-Induced Configuration Loss 2.5V/1.8V/1.5V/1.2V, 3.3V PCI / 3.3V PCI-X, and Low Power LVCMOS 2.5 V / 5.0 V Input Dramatic Reduction in Dynamic and Static Power Differential I/O Standards: LVPECL, LVDS, BLVDS, and M-LVDS 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power Voltage-Referenced I/O Standards: GTL+ 2.5V/3.3V, GTL Low Power Consumption in Flash*Freeze Mode Allows for 2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3 Instantaneous Entry To / Exit From Low-Power Flash*Freeze Class I and II (A3PE3000L only) Mode I/O Registers on Input, Output, and Enable Paths Supports Single-Voltage System Operation Hot-Swappable and Cold-Sparing I/Os Low-Impedance Switches Programmable Output Slew Rate and Drive Strength Programmable Input Delay (A3PE3000L only) High Capacity Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L) 250K to 3M System Gates Weak Pull-Up/-Down Up to 504 kbits of True Dual-Port SRAM IEEE 1149.1 (JTAG) Boundary Scan Test Up to 620 User I/Os Pin-Compatible Packages across the Military ProASIC 3EL Family Reprogrammable Flash Technology Clock Conditioning Circuit (CCC) and PLL 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process Six CCC BlocksOne Block with Integrated PLL in ProASIC3 Live-at-Power-Up (LAPU) Level 0 Support and All Blocks with Integrated PLL in ProASIC3EL Single-Chip Solution Configurable Phase Shift, Multiply/Divide, Delay Capabilities, Retains Programmed Design when Powered Off and External Feedback High Performance Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2V systems) and 350 MHz (1.5 V systems) 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System Performance SRAMs and FIFOs 3.3 V, 66 MHz, 64-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit Variable-Aspect-Ratio 4,608-Bit RAM Blocks (1, 2, 4, 9, PCI (1.2 V systems) and 18 organizations available) In-System Programming (ISP) and Security True Dual-Port SRAM (except 18) Secure ISP Using On-Chip 128-Bit Advanced Encryption 24 SRAM and FIFO Configurations with Synchronous Standard (AES) Decryption via JTAG (IEEE 1532compliant) Operation: 250 MHz: For 1.2 V Systems FlashLock to Secure FPGA Contents 350 MHz: For 1.5 V Systems High-Performance Routing Hierarchy ARM Processor Support in ProASIC3/EL FPGAs Segmented, Hierarchical Routing and Clock Structure High-Performance, Low-Skew Global Network ARM Cortex-M1 Soft Processor Available with or without Debug Table 1 Military ProASIC3/EL Low-Power Devices ProASIC3/EL Devices A3P250 A3PE600L A3P1000 A3PE3000L 1 ARM Cortex-M1 Devices M1A3P1000 M1A3PE3000L System Gates 250,000 600,000 1M 3M VersaTiles (D-flip-flops) 6,144 13,824 24,576 75,264 RAM kbits (1,024 bits) 36 108 144 504 4,608-Bit Blocks 8 24 32 112 FlashROM Kbits 1 1 1 1 2 Secure (AES) ISP Yes Yes Yes Yes Integrated PLL in CCCs 1 6 1 6 VersaNet Globals 18 18 18 18 I/O Banks 4 8 4 8 Maximum User I/Os 68 270 154 620 Package Pins VQFP VQ100 PQFP PQ208 FBGA FG484 FG144, FG484 FG484, FG896 Notes: 1. Refer to the Cortex-M1 product brief for more information. 2. AES is not available for ARM-enabled ProASIC3/EL devices. A3P250 and A3P1000 support only 1.5 V core operation. Flash*Freeze technology is not available for A3P250 or A3P1000. Pro I/Os are not available on A3P250 or A3P1000. September 2012 I 2011 Microsemi CorporationMilitary ProASIC3/EL Low Power Flash FPGAs 1 I/Os Per Package ProASIC3/EL Low Power Devices A3P250 A3PE600L A3P1000 A3PE3000L ARM Cortex-M1 Devices M1A3P1000 M1A3PE3000L Single- Differential Single- Differential Single- Differential Single- Differential 2 2 2 2 Ended I/O I/O Pairs Ended I/O I/O Pairs Ended I/O I/O Pairs Ended I/O I/O Pairs Package VQ100 68 13 PQ208 154 35 FG144 97 25 FG484 270 135 300 74 341 168 FG896 620 300 Notes: 1. When considering migrating your design to a lower- or higher-density device, refer to the packaging section of the datasheet to ensure you are complying with design and board migration requirements. 2. Each used differential I/O pair reduces the number of single-ended I/Os available by two. 3. indicates RoHS-compliant packages. Refer toMilitary ProASIC3/EL Ordering Informatio on page III for the location of the in the part number. 4. For A3PE3000L devices, the usage of certain I/O standards is limited as follows: SSTL3(I) and (II): up to 40 I/Os per north or south bank LVPECL / GTL+ 3.3 V / GTL 3.3 V: up to 48 I/Os per north or south bank SSTL2(I) and (II) / GTL+ 2.5 V/ GTL 2.5 V: up to 72 I/Os per north or south bank 5. When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not as a regular I/O, the number of single-ended user I/Os available is reduced by one. Military ProASIC3/EL Device Status Military ProASIC3/EL Devices Status M1 Military ProASIC3/EL Devices Status A3P250 Production A3PE600L Production A3P1000 Production M1A3P1000 Production A3PE3000L Production M1A3PE3000L Production II Revision 3

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi
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