Product Information

ATSAMA5D27C-LD1G-CU

ATSAMA5D27C-LD1G-CU electronic component of Microchip

Datasheet
Microprocessors - MPU CORTEX-A5 MPU,1GBIT LPDDR2,BGA,IND TEMP

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 20.5505 ea
Line Total: USD 20.5505

1099 - Global Stock
Ships to you between
Wed. 10 Apr to Fri. 12 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
81 - Global Stock


Ships to you between Thu. 04 Apr to Wed. 10 Apr

MOQ : 1
Multiples : 1
1 : USD 22.8585

1099 - Global Stock


Ships to you between Wed. 10 Apr to Fri. 12 Apr

MOQ : 1
Multiples : 1
1 : USD 20.5505
10 : USD 20.4815
25 : USD 19.3315
84 : USD 18.768
5040 : USD 18.768

     
Manufacturer
Product Category
RoHS - XON
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Series
Core
Data Bus Width
Maximum Clock Frequency
Interface Type
Operating Supply Voltage
Number of Cores
Mounting Style
Package / Case
L1 Cache Instruction Memory
L1 Cache Data Memory
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Memory Type
Brand
Data Ram Size
Data Rom Size
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L2 Cache Instruction / Data Memory
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SAMA5D2 SIP SAMA5D2 System in Package (SIP) MPU with up to 1 Gbit DDR2 SDRAM or 2 Gbit LPDDR2 SDRAM Scope This document is an overview of the main features of the SAMA5D2 SIP. The sole reference documents for product information on the SAMA5D2 and the LPDDR2/DDR2-SDRAM memories are listed in the table below. Introduction The SAMA5D2 System-In-Package (SIP) integrates the Arm Cortex -A5 processor-based SAMA5D2 MPU with up to 1 Gbit DDR2-SDRAM or up to 2 Gbit LPDDR2-SDRAM in a single package. By combining the high-performance, ultra-low power SAMA5D2 with LPDDR2/DDR2-SDRAM in a single package, PCB routing complexity, area and number of layers is reduced in the majority of cases. This makes board design easier and more robust by facilitating design for EMI, ESD and signal integrity. DDR2-SDRAM memory sizes and package options available 128 Mbit, TFBGA196 512 Mbit and 1 Gbit, TFBGA289 LPDDR2-SDRAM memory sizes and package options available 1 Gbit and 2 Gbit, TFBGA361 While the smallest option targets applications with a small OS or bare metal, the larger options are suitable for applications using Linux . Reference Documents Type Document Title Available Ref. No. Data sheet SAMA5D2 Series www.microchip.com DS60001476 2 Mwords 4 Banks 16 bits Data sheet www.winbond.com W9712G6KB25I DDR2 SDRAM (128 Mbit) 8 Mwords 4 Banks 16 bits Data sheet www.winbond.com W9751G6KB25I DDR2 SDRAM (512 Mbit) 8 Mwords 8 Banks 16 bits Data sheet www.winbond.com W971GG6SB25I DDR2 SDRAM (1 Gbit) 4 Mwords 8 Banks 32 bits Data sheet www.apmemory.com AD210032F-I-AB LPDDR2-SDRAM (1 Gbit) 8 Mwords 8 Banks 32 bits Data sheet www.apmemory.com AD220032D-I-ED/PC/AB LPDDR2-SDRAM (2 Gbit) Datasheet DS60001484D-page 1 2021 Microchip Technology Inc. SAMA5D2 SIP Table of Contents Scope............................................................................................................................................................. 1 Introduction.....................................................................................................................................................1 Reference Documents....................................................................................................................................1 1. Features..................................................................................................................................................4 2. DDR2-SDRAM Features......................................................................................................................... 7 3. LPDDR2-SDRAM Features.....................................................................................................................8 4. Configuration Summary.......................................................................................................................... 9 5. Chip Identifier........................................................................................................................................10 6. Package and Ballout..............................................................................................................................11 7. Memory................................................................................................................................................. 39 8. Electrical Characteristics.......................................................................................................................40 8.1. Recommended Thermal Operating Conditions..........................................................................40 8.2. Decoupling................................................................................................................................. 40 8.3. Power Sequences...................................................................................................................... 40 9. Mechanical Characteristics................................................................................................................... 45 9.1. 361-ball TFBGA..........................................................................................................................45 9.2. 289-ball TFBGA..........................................................................................................................48 9.3. 196-ball TFBGA..........................................................................................................................49 10. Ordering Information............................................................................................................................. 50 11. Revision History.................................................................................................................................... 51 11.1. DS60001484D - 03/2021............................................................................................................51 11.2. DS60001484C - 01/2020............................................................................................................51 11.3. DS60001484B - 11/2018............................................................................................................51 11.4. DS60001484A - 09/2017............................................................................................................51 The Microchip Website.................................................................................................................................52 Product Change Notification Service............................................................................................................52 Customer Support........................................................................................................................................ 52 Product Identification System.......................................................................................................................53 Microchip Devices Code Protection Feature................................................................................................53 Legal Notice................................................................................................................................................. 54 Trademarks.................................................................................................................................................. 54 Quality Management System....................................................................................................................... 55 DS60001484D-page 2 Datasheet 2021 Microchip Technology Inc.

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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