MSMCG5.0A MXLSMCG170CAe3,
MSMCJ5.0 MXLSMCJ170CAe3
Screening in
Surface Mount 1500 Watt
reference to
Available
MIL-PRF-19500
Transient Voltage Suppressor
available
DESCRIPTION
The MSMCG(J)5.0A through MXLSMCG(J)170A series of 1500 watt high-reliability Transient
Voltage Suppressors (TVSs) protects a variety of voltage-sensitive components. The SMCG gull-
wing design in the DO-215AB package allows for visible solder connections. The SMCJ J-bend
design in the DO-214AB package allows for greater PC board mounting density. Selections include
unidirectional and bidirectional as well as RoHS compliant versions. These are available with a
variety of upscreening options for enhanced reliability. They can protect against the secondary
DO-215AB
effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching
environments and induced by RF radiation. Since their response time is virtually instantaneous,
(SMCG) Package
they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
Important: For the latest information, visit our website MSMCG5.0A MXLSMCG170CAe3,
MSMCJ5.0 MXLSMCJ170CAe3
MAXIMUM RATINGS
Parameters/Test Conditions Symbol Value Unit
Junction and Storage Temperature T and T -65 to +150 C
J STG
Thermal Resistance Junction-to-Lead R 20 C/W
JL
(1)
Thermal Resistance Junction-to-Ambient R 80 C/W
JA
P 1500 W
Peak Pulse Power Dissipation @ 25 C (at 10/1000 s,
PP
see Figures 1, 2, and 3)
Impulse Repetition Rate (duty factor) df 0.01 %
t (0 volts to V min.) Unidirectional t <100 ps
clamping (BR) clamping
Bidirectional <5 ns
Rated Average Power Dissipation T = +30 C P 6 W
L M(AV)
(1)
T = +25 C 1.56
A
(2)
Maximum Forward Surge Current I 200 A (pk)
FSM
o
Solder Temperature @ 10 s T 260 C
SP
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page).
2. Peak impulse of 8.3 ms half-sine wave at 25 C (unidirectional only).
MECHANICAL and PACKAGING
CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0.
TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026.
MARKING: Part number marked on package.
POLARITY: Cathode indicated by band. No cathode band on bi-directional devices.
TAPE & REEL option: Standard per EIA-481-2 with 16 mm tape (add TR suffix to part number). Consult factory for quantities.
WEIGHT: Approximately 0.25 grams.
See Package Dimensions on last page.
PART NOMENCLATURE
MX SM C G 5.0 C A e3
Reliability Level* RoHS Compliance
M e3 = RoHS Compliant
MA Blank = non-RoHS Compliant
MX
MXL +/- 5% Tolerance Level
*(see High Reliability
Up-Screened Plastic
Uni/Bidirectional
Products Portfolio)
C = Bidirectional
Blank = Unidirectional
Surface Mount
Package
Reverse Stand-Off Voltage
(see Electrical Characteristics
1500 W Power Level table)
Gull-wing Lead Frame
G = Gull-Wing
J = J-Bend
RF01001, Rev. A (1/4/13) 2013 Microsemi Corporation Page 2 of 7