MSMLG5.0A MSMLG170CAe3,
MSMLJ5.0 MSMLJ170CAe3
Screening in
Surface Mount 3000 Watt
reference to
Available
MIL-PRF-19500
Transient Voltage Suppressor
available
DESCRIPTION
The MSMLG(J)5.0A through MXLSMLG(J)170A series of high-reliability Transient Voltage
Suppressors (TVSs) protect circuits from voltage spikes containing up to 3000 W (10/1000 s
model pulse. The SMLG gull-wing design in the DO-215AB package allows for visible solder
connections. The SMLJ J-bend design in the DO-214AB package allows for greater PC board
mounting density. Selections include unidirectional and bidirectional as well as RoHS compliant
versions. These are available with a variety of upscreening options for enhanced reliability. They
DO-215AB
protect against the secondary effects of lightning per IEC61000-4-5 and against voltage pulses
from inductive switching environments and induced by RF radiation. Since their response time is
Package
virtually instantaneous, they can also be used in protection from ESD and EFT per IEC61000-4-2
and IEC61000-4-4.
Important: For the latest information, visit our website MSMLG5.0A MSMLG170CAe3,
MSMLJ5.0 MSMLJ170CAe3
MAXIMUM RATINGS
Parameters/Test Conditions Symbol Value Unit
Junction and Storage Temperature T and T -65 to +150 C
J STG
Thermal Resistance Junction-to-Lead R 17.5 C/W
JL
(1)
Thermal Resistance Junction-to-Ambient R 77.5 C/W
JA
Peak Pulse Power Dissipation @ 25 C P 3000 W
PP
(at 10/1000 s, see Figures 1, 2, and 3)
Impulse Repetition Rate (duty factor) df 0.01 or less %
t (0 volts to V min.) Unidirectional t <100 ps
clamping (BR) clamping
Bidirectional <5 ns
Rated Average Power Dissipation T = +45 C P 6 W
L M(AV)
(1)
T = +25 C 1.61
A
(2)
Maximum Forward Surge Current I 200 A (pk)
FSM
o
Solder Temperature @ 10 s T 260 C
SP
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page)
2. Peak impulse of 8.3 ms half-sine wave at 25 C (unidirectional only)
MECHANICAL and PACKAGING
CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0
TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026.
MARKING: Part number marked on package
POLARITY: Cathode indicated by band. No cathode band on bi-directional devices
TAPE & REEL option: Standard per EIA-481-B with 16 mm tape (add TR suffix to part number). Consult factory for quantities.
WEIGHT: Approximately 0.25 grams
See Package Dimensions on last page.
PART NOMENCLATURE
MX SM L G 5.0 C A e3
Reliability Level* RoHS Compliance
M (controlled product) e3 = RoHS Compliant
MA (Avionics grade) Blank = non-RoHS Compliant
MX (reference JANTX)
MXL (MX Lite)
+/- 5% Tolerance Level
Blank = commercial
*(see High Reliability
Uni/Bidirectional
Up-Screened Plastic
C = Bidirectional
Products Portfolio)
Blank = Unidirectional
Surface Mount
Reverse Stand-Off Voltage
Package
(see Electrical Characteristics
table)
3000 W Power Level
Gull-wing Lead Frame
G = Gull-Wing
J = J-Bend
RF01003, Rev. C (7/30/13) 2013 Microsemi Corporation Page 2 of 8