MPLAB ICE 2000
Processor Module and Device Adapter Specification
CONTENTS 2.0 MPLAB ICE 2000 SYSTEM
1.0 Introduction ......................................................... 1 A brief overview of the different components of the
system is shown in the figure below. Each component
2.0 MPLAB ICE 2000 System................................... 1
is discussed in the following subsections.
3.0 Emulator-Related Issues .................................... 2
FIGURE 2-1: MPLAB ICE 2000
4.0 Processor Modules ............................................. 2
EMULATOR SYSTEM
5.0 Device Adapter Issues........................................ 4
Communications Cable
6.0 Device Adapter Target Footprints ..................... 10
Emulator Pod
Processor Module
1.0 INTRODUCTION
with Cable
The processor modules for MPLAB ICE 2000 are Power Supply
Cable
interchangeable personality modules that allow
Logic Probe
MPLAB ICE 2000 to be reconfigured for emulation of
Connector
different PICmicro microcontrollers (MCUs). This
modularity allows the emulation of many different
devices with the addition of a processor module and Device Adapter
device adapter, which provides a very cost effective
Transition Socket
multiprocessor emulation system.
The device adapters for MPLAB ICE 2000 are inter-
2.1 Host to Pod Cable
changeable assemblies that allow the emulator system
This is a standard parallel interface cable. MPLAB ICE
to interface to a target application system. Device
2000 is tested with a 6-foot cable. A longer cable may
adapters also have control logic that allows the target
work, but is not ensured. The cable connects to a par-
application to provide a clock source and power to the
allel port on the PC. If a PC has a printer connected to
processor module. The device adapters support
an LPT device, it is recommended that an additional
PICmicro MCUs in DIP, SDIP and PLCC packages.
interface card be installed, rather than using a splitter
Transition sockets, used along with a device adapter,
or an A/B switch.
provide a method of accommodating all PICmicro MCU
packages, including SOIC, SSOP, PQFP and TQFP
2.2 Emulator Pod
packages.
The Emulator Pod contains emulator memory and
control logic. MPLAB ICE 2000 contains a main board
and an additional board for expanded trace memory
and complex control logic. There are no field service-
able parts in the pod. For more information on the pod,
see the MPLAB ICE 2000 on-line help file in MPLAB
IDE (Help>Topics) or the MPLAB ICE 2000
In-Circuit Emulator Users Guide (DS51488).
The MPLAB ICE 2000 processor module is inserted
into the pod for operation.
2.3 Processor Module
The processor module contains the emulator chip, logic
and low-voltage circuitry. There are no field-serviceable
parts mounted on the printed circuit board housed
within the processor module enclosure.
2006 Microchip Technology Inc. DS51140M-page 1
MPLAB ICE 2000
2.4 Flex Circuit Cable
3.0 EMULATOR-RELATED ISSUES
General limitations that apply to the MPLAB ICE 2000
Once the processor module is inserted into the
emulator may be found in the on-line help. Select
emulator pod, the flex circuit cable extends the
Help>Topics and then select MPLAB ICE 2000 under
emulator system to the target application. This is a
Debuggers.
custom cable that is attached inside the processor
module enclosure, and can be replaced in the field by
Device-specific limitations can be found as above or by
removing the end cap of the processor module
selecting Debugger>Settings, clicking the Limitations
enclosure.
tab, and then clicking the Details button.
Please, DO NOT PULL on the flex circuit cable to
remove the processor module from the pod. Use the
4.0 PROCESSOR MODULES
fins of the processor module end cap to leverage the
Processor modules are identified on the top of the
module from the pod.
assembly (e.g., PCM18XA0). To determine which
Emulator analog functions may not operate within the
processors are supported by a specific module, refer to
performance specifications published in the device
the file Readme for MPLAB ICE 2000.txt in the
data sheet due to parasitic capacitance (up to 120 pf)
MPLAB IDE installation directory or the latest Product
of the flex cable.
Selector Guide (DS00148), which can be found on the
Microchip web site at www.microchip.com.
2.5 Device Adapter
A typical processor module contains a special bond-out
The device adapter provides a common interface for
version of a PICmicro MCU, with device buffers to
the device being emulated. It is provided in standard
control data flow and control logic. It provides the
DIP and PLCC styles. The adapter also contains a spe-
means of configuring the MPLAB ICE 2000 emulator
cial device that provides an oscillator clock to accu-
for a specific PICmicro MCU family and handles
rately emulate the oscillator characteristics of the
low-voltage emulation when needed.
PICmicro MCU.
Note: When removing the processor module, DO
Due to components on the device adapter, which
NOT PULL on the flex cable. Use the tabs
require target power, the device adapter should be
on the processor module or damage to the
removed from the flex circuit cable (see Figure 2-1)
flex cable may occur.
when emulator power is being used and the processor
module is not connected to the target. This will
4.1 Power
eliminate any loading effects on I/O pins.
The operating voltage for most of the control logic and
2.6 Transition Socket
buffering on the processor module is +5V and is
supplied by the emulator pod. Power to the emulator
Transition Sockets are available in various styles to
processor and some of its surrounding buffers is user-
allow a common device adapter to be connected to one
selectable, and can be powered by the emulator pod
of the supported surface mount package styles. Transi-
(at +5V only) or the target application system (from
tion sockets are available for various pin counts and
2.0V to 5.5V). This is software selectable and is
pitches for SOIC, QFP and other styles. For more infor-
configurable through the MPLAB IDE software. At no
mation on transition sockets, see the MPLAB ICE
time will the emulator system directly power the target
2000/4000 Transition Socket Specification (DS51194).
application system. ALWAYS insert the processor
An emulator system consists of the following
module into the emulator pod before applying power to
components which can be ordered separately:
the pod.
An emulator pod (including the host-to-pod cable
When connecting to a target application system, there
and power supply)
may be a voltage level on the target application even
A processor module (including the flex circuit
though power has not yet been applied to the target
cable)
application circuit. This is normal, and is due to current
leakage through VCC of the device adapter. The current
A device adapter
leakage will typically be less than 20 mA. However, if
An optional transition socket (for surface mount
the target application is using a voltage regulator, it
emulation)
should be noted that some regulators require the use of
an external shunt diode between VIN and VOUT for
reverse-bias protection. Refer to the manufacturers
data sheets for additional information.
DS51140M-page 2 2006 Microchip Technology Inc.