Product Information

QT60240-ATG

QT60240-ATG electronic component of Microchip

Datasheet
Capacitive Touch Sensors INTEGRATED-CIRCUIT

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1

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QT60240-ATG
Microchip

1 : USD 5.8675
10 : USD 5.2337
25 : USD 4.7103
100 : USD 4.2917
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Y2B X4 SMP X3 SDA X2 SCL X1 /RST X0 Y0A S_SYNC Y1A VREF Y2A LATCH lQ QT60160, QT60240 16 AND 24 KEY QMATRIX TOUCH SENSOR ICs These devices are designed for low cost mobile and consumer electronics applications. 31 30 27 25 32 29 28 26 QMatrix technology employs transverse charge-transfer sensing electrode M_SYNC 1 24 Y1B designs which can be made very compact and are easily wired. Charge is CHANGE 2 23 Y0B forced from an emitting electrode into the overlying panel dielectric, and then VSS 3 22 A0 QT60240 collected on a receiver electrode which directs the charge into a sampling VDD 4 QT60160 21 VSS capacitor which is then converted directly to digital form without the use of VSS 5 20 VDD amplifiers. VDD 6 MLF-32 19 A1 Keys are configured in a matrix format that minimizes the number of required X6 7 18 VDD scan lines and device pins. The key electrodes can be designed into a X7817 X5 910 11 12 13 14 15 16 conventional Printed Circuit Board (PCB) or Flexible Printed Circuit Board (FPCB) as a copper pattern, or as printed conductive ink on plastic film. AT A GLANCE Number of keys: 1 to 16 (QT60160), or 1 to 24 (QT60240) Technology: Patented spread-spectrum charge-transfer (transverse mode) Key outline sizes: 6mm x 6mm or larger (panel thickness dependent); widely different sizes and shapes possible Key spacings: 8mm or wider, center to center (panel thickness dependent) Electrode design: Two-part electrode shapes (drive-receive); wide variety of possible layouts Layers required: One layer (with jumpers), two layers (no jumpers) Electrode materials: PCB, FPCB, silver or carbon on film, ITO on film, Orgacon ink on film Panel materials: Plastic, glass, composites, painted surfaces (low particle density metallic paints possible) Adjacent Metal: Compatible with grounded metal immediately next to keys Panel thickness: Up to 50mm glass, 20mm plastic (key size dependent) Key sensitivity: Individually settable via simple commands over serial interface 2 Interface: I C slave mode (100kHz), or parallel output via external shift registers Moisture tolerance: Best in class. Power: 1.8V ~ 5.5V, 40A (16 keys at 1.8V, 2s Low Power mode). Guaranteed to 1.62V. Package: 32-pin 5 x 5mm MLF RoHS compliant TM Signal processing: Self-calibration, auto drift compensation, noise filtering, Adjacent Key Suppression Applications: Mobile phones, remote controls, domestic appliances, PC peripherals, automotive Orgacon is a registered trademark of Agfa-Gevaert N.V AVAILABLE OPTIONS Part Number Keys T A 0 0 QT60160-ISG 16 -40 C to +85 C 0 0 QT60240-ISG 24 -40 C to +85 C LQ Copyright 2006 QRG Ltd QT60240-ISG R8.06/0906Contents 1 Overview 5 I2C Operation ............................... 3 ............................ 15 1.1 Introduction 5.1 Interface Bus ............................ 3 ........................... 15 1.2 Part Differences 5.2 Transferring Data Bits .......................... 3 ....................... 15 1.3 Enabling / Disabling Keys 5.3 START and STOP Conditions ..................... 3 ................... 15 5.4 Address Packet Format 2 Hardware and Functional ..................... 3 ...................... 15 2.1 Matrix Scan Sequence 5.5 Data Packet Format ....................... 3 ........................ 15 2.2 Burst Paring 5.6 Combining Address and Data Packets Into a Transmission ............................ 3 .... 16 2.3 Cs Sample Capacitor Operation 6 Setups .................. 3 ................................ 17 2.4 Sample Capacitor Saturation 6.1 Introduction ................... 4 ............................ 17 2.5 Sample Resistors 6.2 Negative Threshold - NTHR ......................... 4 .................... 17 2.6 Signal Levels 6.3 Positive Threshold - PTHR ........................... 4 .................... 17 2.7 Matrix Series Resistors 6.4 Drift Compensation - NDRIFT, PDRIFT ...................... 5 .............. 17 2.8 Key Design 6.5 Detect Integrators - NDIL, FDIL ............................ 6 .................. 18 2.9 PCB Layout, Construction 6.6 Negative Recal Delay - NRD ..................... 6 .................... 18 2.9.1 Overview 6.7 Positive Recalibration Delay - PRD ........................... 6 ................ 18 2.9.2 LED Traces and Other Switching Signals 6.8 Burst Length - BL .............. 6 ......................... 19 2.9.3 PCB Cleanliness 6.9 Adjacent Key Suppression - AKS ........................ 6 ................. 19 2.10 Power Supply Considerations 6.10 Oscilloscope Sync - SSYNC .................. 6 ................... 19 2.11 Startup / Calibration Times 6.11 Mains Sync - MSYNC .................... 7 ...................... 19 2.12 Reset Input 6.12 Sleep Duration - SLEEP ........................... 7 ..................... 20 2.13 Spread Spectrum Acquisitions 6.13 Wake on Key Touch - WAKE .................. 7 ................... 20 2.14 Detection Integrators 6.14 Awake Timeout - AWAKE ....................... 7 .................... 20 2.15 Sleep 6.15 Drift Hold Time - DHT .............................. 7 ...................... 20 2.16 Wiring 6.16 Setups Block .............................. 8 .......................... 21 3 Interfaces 7 Specifications .............................. 10 ........................... 23 3.1 Introduction 7.1 Absolute Maximum Electrical Specifications ............................ 10 ............ 23 3.2 Shift Register Output Mode 7.2 Recommended Operating Conditions .................... 10 ............... 23 3.3 I2C Port 7.3 DC Specifications .............................. 10 ......................... 23 3.4 CHANGE Pin 7.4 Timing Specifications ........................... 11 ....................... 23 7.5 Power Consumption 4 Control Commands ........................ 12 ........................ 24 4.1 Introduction 7.6 Mechanical Dimensions ............................ 12 ...................... 25 4.2 Writing Data to the Device 7.7 Marking ..................... 12 .............................. 25 4.3 Reading Data From the Device 7.8 Moisture Sensitivity Level (MSL) .................. 12 .................. 25 4.4 Report Detections for All Keys ................... 12 4.5 Raw Data Commands ....................... 13 4.6 Cal All ............................... 13 4.7 Setups .............................. 13 lQ 2 QT60240-ISG R8.06/0906

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