Product Information

BAP51-02-TP

BAP51-02-TP electronic component of Micro Commercial Components (MCC)

Datasheet
RF Diode PIN - Single 60V 50 mA 715 mW SOD-523

Manufacturer: Micro Commercial Components (MCC)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.513 ea
Line Total: USD 0.51

3758 - Global Stock
Ships to you between
Thu. 23 May to Mon. 27 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
3749 - WHS 1


Ships to you between Thu. 23 May to Mon. 27 May

MOQ : 1
Multiples : 1

Stock Image

BAP51-02-TP
Micro Commercial Components (MCC)

1 : USD 0.437
10 : USD 0.2817
100 : USD 0.1219
1000 : USD 0.0954
2500 : USD 0.077
8000 : USD 0.0713
48000 : USD 0.0644

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Vr - Reverse Voltage
Maximum Diode Capacitance
If - Forward Current
Vf - Forward Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Mounting Style
Package / Case
Series
Packaging
Brand
Power Dissipation
Factory Pack Quantity :
Termination Style
Cnhts
Hts Code
Mxhts
Pd - Power Dissipation
Product Type
Subcategory
Taric
LoadingGif

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BAP51-02 Features Lead Free Finish/RoHS Compliant Suffix Designates RoHS Compliant. See Ordering Information) General Epoxy Meets UL 94 V-0 Flammability Rating Moisture Sensitivity Level 1 Purpose Pin Diodes Low Diode Capacitance 715mW Low Diode Forward Resistance Halogen Free.Gree Device (Note 1) Maximum Ratings Operating Junction Temperature Range: -65C to +150C Storage Temperature Range: -65C to +150C SOD-523 Thermal Resistance: 85C/W Junction to Solder Point Symbol Parameter Limits Unit Continuous Reverse Voltage V R 60 V A I mA Forward Current 50 B F o P 715 mW Power Dissipation(T =90 C) A D C E Note: 1. Halogen freeGreen products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Cathode Mark G F Device MarkingA5 DIMENSIONS INCHES MM DIM NOTE MIN MAX MIN MAX A 0.059 0.067 1.50 1.70 B 0.043 0.051 1.10 1.30 C 0.030 0.033 0.75 0.85 E 0.010 0.014 0.25 0.35 F 0.003 0.008 0.08 0.20 G 0.020 0.026 0.50 0.65 SUGGESTED SOLDER PAD LAYOUT 1.1mm 0.8mm 0.6mm Rev.3-4-12012020 1/4 MCCSEMI.COMBAP51-02 Electrical Characteristics 25C Unless Otherwise Specified Parameter Symbol MinMin.. Typ Max. Conditions Continuous Reverse Voltage V 50V I =10A R R Forward Voltage V I =50mA 1.1V F F Reverse Current I 100nA V =50V R R V =0V,f=1MHz C 0.4pF R d1 Diode Capacitance V =1V,f=1MHz C 0.55pF R d2 V =5V,f=1MHz C 0.35pF R d3 R 9 I =0.5mA,f=100MHz F D Diode Forward Resistance I =1.0mA,f=100MHz R 6.5 D F R I =10mA,f=100MHz 2.5 F D Rev.3-4-12012020 2/4 MCCSEMI.COM

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
MCC
MCC(Micro Commercial Components)
MICRO COMMERCIAL
Micro Commercial Co
Micro Commercial Components

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