BAP51-02-TP Micro Commercial Components (MCC)

BAP51-02 Features Lead Free Finish/RoHS Compliant Suffix Designates RoHS Compliant. See Ordering Information) General Epoxy Meets UL 94 V-0 Flammability Rating Moisture Sensitivity Level 1 Purpose Pin Diodes Low Diode Capacitance 715mW Low Diode Forward Resistance Halogen Free.Gree Device (Note 1) Maximum Ratings Operating Junction Temperature Range: -65C to +150C Storage Temperature Range: -65C to +150C SOD-523 Thermal Resistance: 85C/W Junction to Solder Point Symbol Parameter Limits Unit Continuous Reverse Voltage V R 60 V A I mA Forward Current 50 B F o P 715 mW Power Dissipation(T =90 C) A D C E Note: 1. Halogen freeGreen products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Cathode Mark G F Device MarkingA5 DIMENSIONS INCHES MM DIM NOTE MIN MAX MIN MAX A 0.059 0.067 1.50 1.70 B 0.043 0.051 1.10 1.30 C 0.030 0.033 0.75 0.85 E 0.010 0.014 0.25 0.35 F 0.003 0.008 0.08 0.20 G 0.020 0.026 0.50 0.65 SUGGESTED SOLDER PAD LAYOUT 1.1mm 0.8mm 0.6mm Rev.3-4-12012020 1/4 MCCSEMI.COMBAP51-02 Electrical Characteristics 25C Unless Otherwise Specified Parameter Symbol MinMin.. Typ Max. Conditions Continuous Reverse Voltage V 50V I =10A R R Forward Voltage V I =50mA 1.1V F F Reverse Current I 100nA V =50V R R V =0V,f=1MHz C 0.4pF R d1 Diode Capacitance V =1V,f=1MHz C 0.55pF R d2 V =5V,f=1MHz C 0.35pF R d3 R 9 I =0.5mA,f=100MHz F D Diode Forward Resistance I =1.0mA,f=100MHz R 6.5 D F R I =10mA,f=100MHz 2.5 F D Rev.3-4-12012020 2/4 MCCSEMI.COM