Product Information

MT48LC2M32B2P-6A AAT:J TR

MT48LC2M32B2P-6A AAT:J TR electronic component of Micron

Datasheet
DRAM SDRAM 64M 2MX32 TSOP

Manufacturer: Micron
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 9.8435
25 : USD 6.5606
50 : USD 6.5392
N/A

Obsolete
     
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Product Category
RoHS - XON
Icon ROHS
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Memory Size
Maximum Clock Frequency
Access Time
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
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Mxhts
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64Mb: x32 Automotive SDRAM Features Automotive SDR SDRAM MT48LC2M32B2 512K x 32 x 4 Banks Options Marking Features Configuration PC100-compliant 2 Meg x 32 (512K x 32 x 4 banks) 2M32B2 Fully synchronous all signals registered on positive on page Plastic package OCPL edge of system clock 86-pin TSOP II (400 mil) standard TG Internal pipelined operation column address can 86-pin TSOP II (400 mil) Pb-free P be changed every clock cycle 90-ball VFBGA (8mm x 13mm) Pb- B5 Internal banks for hiding row access/precharge free Programmable burst lengths: 1, 2, 4, 8, or full page Timing cycle time Auto precharge, includes concurrent auto precharge 5ns (200 MHz) -5 and auto refresh modes 2 5.5ns (183 MHz) -55 Self refresh mode (not available on AT devices) 2 6ns (167 MHz) -6 Auto refresh 3 6ns (167 MHz) -6A 64ms, 4096-cycle, 15.6s/row (commercial and 2 7ns (143 MHz) -7 industrial) Automotive certified 16ms, 4096-cycle, 3.9s/row (automotive) Automotive A LVTTL-compatible inputs and outputs Operating temperature range Single 3.3V 0.3V power supply Industrial (40C to +85C) IT Supports CAS latency (CL) of 1, 2, and 3 4 Automotive (40C to +105C) AT AEC-Q100 Revision :G/:J PPAP submission 1. Off-center parting line. Notes: 8D response time 2. Available only on revision G. 3. Available only on revision J. 4. Contact Micron for availability. Table 1: Key Timing Parameters CL = CAS (READ) latency Clock t t t t Speed Grade Frequency (MHz) Target RCD- RP-CL RCD (ns) RP (ns) CL (ns) -5 200 3-3-3 15 15 15 -55 183 3-3-3 16.5 16.5 16.5 -6 167 3-3-3 18 18 18 -6A 167 3-3-3 18 18 18 -7 143 3-3-3 20 20 20 09005aef84d5580d Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 64mb x32 aat-ait sdram.pdf - Rev. C 06/18 EN 2012 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.64Mb: x32 Automotive SDRAM Features Table 2: Address Table Parameter 2 Meg x 32 Configuration 512K x 32 x 4 banks Refresh count 4K Row addressing 2K A 10:0 Bank addressing 4 BA 1:0 Column addressing 256 A 7:0 Table 3: 64Mb (x32) SDR Part Numbering Part Numbers Architecture Package MT48LC2M32B2TG 2 Meg x 32 86-pin TSOP II MT48LCM32B2P 2 Meg x 32 86-pin TSOP II 1 MT48LC2M3B2B5 2 Meg x 32 90-ball VFBGA Note: 1. FBGA Device Decoder: www.micron.com/decoder. 09005aef84d5580d Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 64mb x32 aat-ait sdram.pdf - Rev. C 06/18 EN 2012 Micron Technology, Inc. All rights reserved.

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
EL9
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)

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