HTSC427.xxx - 1206 High Temperature Silicon Capacitor Rev 3.1 Key features Key applications n All applications up to 200C, such as n High stability up to 200C: military, aerospace and automotive w Temperature <1% (-55 C to +200 C) industries w Voltage <0.1 %/V n High reliability applications w Negligible capacitance loss through aging n Replacement of X7R and C0G dielectrics n Unique high capacitance in EIA/1206 package n Decoupling / Filtering / Charge pump size, up to 1 F (i.e.: motor management, temperature sensors) n High reliability (FIT <0.017 parts / billion hours) n Downsizing n Low leakage current down to 100 pA n Low ESL and Low ESR n Suitable for lead free reflow-soldering *Please refer to our assembly Application Note for further recommendations Thanks to the unique IPDiA Silicon capacitor The IPDiA technology offers industry leading technology, most of the problems encountered in performances relative to Failure rate with a demanding applications can be solved. FIT<0.017. High Temperature Silicon Capacitors are This technology also offers high reliability, up to dedicated to applications where reliability up to 10 times better than alternative capacitor 200C is the main parameter. technologies, such as Tantalum or MLCC, and This technology features a capacitor integration eliminates cracking phenomena. capability (up to 250nF/mm ) which offers This Silicon based technology is RoHS compliant capacitance value similar to X7R dielectric, but and compatible with lead free reflow soldering with better electrical performances than C0G/NP0 process. dielectrics, up to 200C HTSC provide the highest capacitor stability over the full -55C/+200C temperature range in the market with a Temperature coefficient Lower than 1%. HTSC427.xxx Electrical specification Capacitance value Parameters Value (***) Capacitance range 10 nF to 1F 10 15 22 33 47 68 (***) Capacitance tolerances 15 % 10nF Contact Contact Contact Contact Contact (**) 1 nF 935.132.427.510 IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales -55 C to 200 C Operating temperature range 100nF Contact Contact Contact Contact Contact Storage temperatures - 70 C to 215 C 10 nF 935.132.427.610 IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales Temperature coefficient <1 %, from -55 C to +200 C 1F (***) 0,1 F Breakdown voltage (BV) 11 VDC 935.132.427.710 Capacitance variation versus 0.1 % /V (from 0 V to RVDC) 1 F RVDC Equivalent Serial Inductor (ESL) Max 1nH (*) Thinner thickness (as low as 100 m thick) available, see Low Profile Silicon Capacitor product: LPSC (***) Equivalent Serial Resistor (ESR) Max 500mW 50GW min 3V,25C (**) Extended temperature range (up to +250 C) available, see Xtreme Temperature Silicon Capacitor product: XTSC Insulation resistance 20GW min 3V,200C Negligible, < 0.001 % / 1000h Ageing (***) Other values on request. Reliability FIT<0.017 parts / billion hours, (*) Capacitor height Max 400 m DC Voltage stability ESL (nH) 25C MLCC capacitors vs. PICS 0402 C0G(NPO) vs. PICS 1,1 10 PICS 0 1 C0G 0,9 -10 C0G 0,8 -20 0,7 -30 X7R 0,6 -40 0,5 -50 0,4 -60 0,3 -70 0,2 -80 Y5V PICS 0,1 -90 0 -100 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 0 1 2 3 4 5 6 7 Capacitance (pF) Bias voltage (V) Fig.1 Capacitance change versus temperature Fig.2 Capacitance change versus voltage Fig.3 ESL versus capacitance value variation compared with alternative dielectrics variation compared with alternative dielectrics compared with alternative dielectrics Part Number 935.132. B.2 S. U xx Value 10 Breakdown 15 Voltage 22 Size Unit 4 = 11V 33 i.e.: 1 F/1206 case (HTSC type) 7 = 1206 5 = 1 n 0 = 10 f 47 6 = 10 n 1 = 0.1 p 68 935.132.427.710 7 = 0.1 2 = 1 p 8 = 1 3 = 10 p 9 = 10 4 = 0.1 n Termination and Outline Termination Package outline Lead-free nickel/solder coating compatible L with automatic soldering technologies: Typ. 1206 W reflow and manual. L 3.400.05 Comp. Solder size Land IPD W 1.800.05 Resist component pattern Typical dimensions, all dimensions in mm. (1206 PCB footprint) Packaging Tape and reel, tray, waffle pack or wafer delivery. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information For more information, please visit: