BLE32PN300SN1L

Spec. No. JENF243A-0047D-01 P.1/8 Reference Only Chip Power Bead BLE32PNSN1 Reference Specification 1. Scope This reference specification applies to Chip Power Bead BLE32PN SN Series. 2. Part Numbering (ex.) BL E 32 PN 300 S N 1 L (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (6)Performance (2)Type (7)Category (3)Dimension (L) (8)Numbers of Circuit (4)Characteristics (9)Packaging (L:Taping / B:Bulk) (5)Typical Impedance at 100MHz 3. Rating Impedance () DC Resistance (at 100MHz,Under Standard Rated (m) max. Customer MURATA Testing Condition) Current Initial Values Remark Part Number Part Number (A) Values After Typical Testing BLE32PN260SN1L 2610 26 10 1.6 2.1 BLE32PN260SN1B For DC BLE32PN300SN1L power line 3010 30 10 1.6 2.1 BLE32PN300SN1B Operating Temperature: -55C to +125C Storage Temperature: -55C to +125C 4. Style and Dimensions Equivalent Circuit T Resistance element becomes () dominant at high frequencies. Unit Mass (Typical value) :Electrode BLE32PN260SN1*0.060 BLE32PN300SN1*0.080 Item Dimension T BLE32PN260SN1* 1.5+0.1/-0.2 BLE32PN300SN1* 2.00.2 (in mm) 5. Marking No marking. 6. Standard Testing Conditions < Unless otherwise specified > < In case of doubt > Temperature : Ordinary Temp. (15 C to 35 C ) Temperature : 20C2 C Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa MURATA MFG.CO., LTD. Spec. No. JENF243A-0047D-01 P.2/8 Reference Only 7. Specifications 7-1. Electrical Performance No. Item Specification Test Method 7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz1MHz Measuring Equipment :KEYSIGHT 4291A or the equivalent Test Fixture : KEYSIGHT 16192A or the equivalent 7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter * Except resistance of the Substrate and Wire 7-2. Mechanical Performance No. Item Specification Test Method 7-2-1 Appearance and Meet item 4. Visual Inspection and measured with Slide Calipers. Dimensions It shall be soldered on the substrate. 7-2-2 Bonding Meet Table 1. Applying Force(F) : 9.8N Strength Applying Time : 5s1s Table 1 Applied direction:Parallel to substrate Appearance No damage Side view Impedance Change Within 30% R0.5 (at 100MHz) DC Meet item 3. Resistance Substrate 7-2-3 Bending It shall be soldered on the substrate. Strength Substrate: Glass-epoxy 100mm40mm1.0mm Deflection: 2.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s Pressure jig R230 F n 45mm 45mm Product 7-2-4 Vibration It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20 min 2 Total Amplitude : 3.0mm or Acceleration amplitude 245m/s whichever is smaller. Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) Pre-Heating : 150C10C, 60s90s 7-2-5 Resistance Solder : Sn-3.0Ag-0.5Cu to Soldering Solder Temperature : 270C5C Heat Immersion Time : 10s0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h4h. 7-2-6 Drop Products shall be no failure It shall be dropped on concrete or steel board. after tested. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction (Total 9 times) MURATA MFG.CO., LTD.