BSP100,135 Nexperia

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of Philips Semiconductors Product specification N-channel enhancement mode BSP100 TrenchMOS transistor FEATURES SYMBOL QUICK REFERENCE DATA Trench technology d V = 30 V DSS Low on-state resistance Fast switching I = 6 A D High thermal cycling performance Low thermal resistance R 100 m (V = 10 V) g DS(ON) GS R 200 m (V = 4.5 V) DS(ON) GS s GENERAL DESCRIPTION PINNING SOT223 N-channel enhancement mode PIN DESCRIPTION 4 field-effect transistor in a plastic envelope using trench 1 gate technology. 2 drain Applications:- Motor and relay drivers 3 source d.c. to d.c. converters Logic level translator 4 drain (tab) 1 23 The BSP100 is supplied in the SOT223 surface mounting package. LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V Drain-source voltage T = 25 C to 150C - 30 V DSS j V Drain-gate voltage T = 25 C to 150C R = 20 k -30 V DGR j GS V Gate-source voltage - 20 V GS 1 I Continuous drain current T = 25 C - 6 A D sp T = 100 C - 4.4 A sp T = 25 C - 3.2 A amb I Pulsed drain current T = 25 C - 24 A DM sp P Total power dissipation T = 25 C - 8.3 W D sp T, T Operating junction and - 65 150 C j stg storage temperature THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT R Thermal resistance junction to surface mounted, FR4 12 15 K/W th j-sp solder point board R Thermal resistance junction to surface mounted, FR4 70 - K/W th j-amb ambient board 1 Continuous current rating limited by package February 1999 1 Rev 1.000