Product Information

PESD5V0L1BSF

PESD5V0L1BSF electronic component of Nexperia

Datasheet
DIODE, BIDIRECTIONAL, 5V, SOD-962
Manufacturer: Nexperia
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5: USD 0.2822 ea
Line Total: USD 1.41

0 - Global Stock
MOQ: 5  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 5
Multiples : 1

Stock Image

PESD5V0L1BSF
Nexperia

5 : USD 0.2822
100 : USD 0.1264
1000 : USD 0.074
2500 : USD 0.0714

Read More Specifications

     
Manufacturer
Product Category
Packaging
Operating Voltage
Clamping Voltage Vc Max
Diode Case Style
No Of Pins
Power Dissipation Pd
Product Range
Svhc
Msl
LoadingGif

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Additional Infomation About Product

AN11046 Recommendations for PCB assembly of DSN0603-2 Rev. 3 30 September 2016 Application note Document information Info Content Keywords DSN0603, DSN0603-2, SOD962, 0603 package size, reflow soldering, surface mount, solder paste, stencil aperture, Printed-Circuit Board (PCB), Solder Mask Defined (SMD), footprint, landing pattern, pick and place, Chip-Scale Package (CSP) Abstract This application note provides guidelines for board assembly of the 2 ultra-small DSN0603-2 (0.6 0.3 mm ) chip-scale package. The main focus is on recommendations for reflow soldering. For general information about footprint design and reflow soldering, see application note AN10365 (Surface mount reflow soldering description). If not otherwise stated, all measurement units given in this document are metric units. This means that also the package nomenclature (for example the term0603 ) refers to metric units.AN11046 NXP Semiconductors Recommendations for PCB assembly of DSN0603-2 Revision history Rev Date Description 1 20120601 Initial version 2 20150923 Completely revised document 3 20160930 Section 1: added comment on tilting and occupied area Contact information For more information, please visit:

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