Automotive Grade Ceramic Chip Capacitors NMC-A Series FEATURES MANUFACTURED AT ISO/TS 16949 PRODUCTION FACILITY AEC-Q200 QUALIFIED SURFACE MOUNT CASE SIZES 0201, 0402, 0603, 0805, 1206 & 1210 AVAILABLE IN NPO & X7R DIELECTRICS VOLTAGE RATINGS TO 630VDC SPECIFICATIONS Type NPO X7R Capacitance Range 0.1pF ~ 0.039F 100pF ~ 1.0F <5.0pF: A (0.05pF), B (0.1pF), C (0.25pF) Capacitance Tolerance >5.0pF<10pF: B (0.1pF), C (0.25pF), D (0.5pF) J (5%), 10% (K), 20% (M) >10pF: F (1%), G (2%), J (5%) Operating Temperature Range -55C ~ +125C -55C ~ +125C Temperature Characteristics 030 ppm/C 15% Rated Voltages (VDC) 10V, 16V, 25V, 50V, 100V, 200V, 250V, 500V & 630V Cap. >30pF: Q = 1,000 min. Q Factor (Q) DF Max. Cap. <30pF: Q = 400 +20xC Dissipaton Factor (DF) (See Values & Specificaitons Tables) (See Values & Specificaitons Tables) Insulation Resistance 25C <100V 10,000MW or 500MW F whichever is less 10,000MW or 500MW F < Rated Voltage for 60 Sec. >100V 10,000MW or 100MW F whichever is less Whichever is less Dielectric Withstanding Voltage See Values & Specificaitons Tables <1000pF (1MHz10%), 1.0Vrms 0.2Vrms Test Conditions 1KHz, 1.0V 0.2Vrms >1000pF (1KHz 10%), 1.0Vrms 0.2Vrms Note: Reflow soldering allowed for all case sizes. Contact NIC for wave soldering restrictions. PART NUMBER SYSTEM NMC-A 0603 X7R 103 K 50 C 3 Q Y F RoHS Compliant Q = AEC-Q200 qualification Production Code Packaging: C = 7 paper, D = 13 paper E = 7 plastic, F = 13 plastic Voltage (Vdc) Capacitance Tolerance Code (see chart) Capacitance Code, expressed in pF, first 2 digits are significant, 3rd digit is no. of zeros, R indicates decimal for under 10pF Temperature Characteristic Size Code (see chart) Series denotes suitable for automotive equipment, sourced to special production and inspection at TS-16949 certified production site CASE SIZE DIMENSIONS (mm) EIA Case Size 0201 0402 0603 0805 1206 1210 Length (L) 0.60 0.03 1.0 0.05 1.6 +0.15/-0.10 2.0 0.15 3.2+0.30/-0.10 3.20.40 Width (W) 0.30 0.03 0.5 0.05 0.8 +0.15/-0.10 1.25 0.10 1.6+0.30/-0.10 2.50.30 Thickness max. (T) See Part Number and Specifications Tables Termination Width (P) 0.10 ~ 0.20 0.15 ~ 0.30 0.25 ~ 0.65 0.30 ~ 0.70 0.40 ~ 0.80 0.50 ~ 1.00 W T P P L 100% Sn over Ni barrier NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 1 Specifications are subject to changeAutomotive Grade Ceramic Chip Capacitors NMC-A Series AEC-Q200 - STRESS TEST QUALIFICATION FOR PASSIVE COMPONENTS GRADE: 1 TEMPERATURE RANGE: -40C ~ +125C PASSIVE COMPONENT TYPE: Capacitors, Ceramic Type (MLCCs) ITEM TEST TEST CONDITIONS 1 Electrical Test 25C 2 High Temperature Exposure 150C, 1,000Hr 3 Temperature Cycling Min temp. 25C Max temp., 1,000 cycle 4 Destructive Physical Analysis Electrical Test not required 5 Moisture Resistance 25~65C, 90%RH, 10 cycle 6-1 Biased Humidity 85C, 85%RH, Vr, 1,000Hr 6-2 Low Biased Humidity 85C, 85%RH, 1.3~1.5V, 1,000Hr 7 High Temperature Operating Life Max temp, Vr for 1,000Hr 8 External Visual All qualification parts submitted 9 Physical Dimensions Vernier Calipers 10 Mechanical Shock 1,500G, 15.4ft/s, Half Sine, Total 18 times 11 Vibration 10~2,000Hz, 5G s for 20min, Total 36 cycles 12 Resistance to Solder Heat 265C, 10sec 14 Thermal Shock Min temp (15min)Max temp (15min), air to air, 300 cycle 14 ESD 22C, 2KW, DC 0.5~8kV & AD 12~25kV 15-1 Solderability (Dry heat) 155C, 4Hr 245C, 5 sec 15-2 Solderability (Steam aging) 93C, 8Hr 220C, 10 sec 15-3 Solderability (Dewetting) 93C, 8Hr 260C, 10 sec 16 Electrical Characterization 25C, 125C 17 Board Flex Deflection Point = 2mm (Class II),3mm (Class I), 1mm/sec, 5 sec Capacitance Temperature 18 25 -55 25 125C Characteristics 19 Terminal Strength (SMD) 0402 - 2N, 0603 -10N, 0805 and larger - 18N, for 601 sec. 20 Beam Load 2.5mm/sec NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 2 Specifications are subject to change