74HC238N,652 NXP

74HC238; 74HCT238 3-to-8 line decoder/demultiplexer Rev. 03 16 July 2007 Product data sheet 1. General description 74HC238 and 74HCT238 are high-speed Si-gate CMOS devices and are pin compatible with Low-Power Schottky TTL (LSTTL). The 74HC238/74HCT238 decoders accept three binary weighted address inputs (A0, A1, A2) and when enabled, provide 8 mutually exclusive active HIGH outputs (Y0 to Y7). The 74HC238/74HCT238 features three enable inputs: two active LOW (E1 and E2) and one active HIGH (E3). Every output will be LOW unless E1 and E2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion of the 238 to a 1-to-32 (5 lines to 32 lines) decoder with just four 238 ICs and one inverter. The 238 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Unused enable inputs must be permanently tied to their appropriate active HIGH or LOW state. The 74HC238/74HCT238 is similar to the 74HC138/74HCT138 but has non-inverting outputs. 2. Features n Demultiplexing capability n Multiple input enable for easy expansion n Ideal for memory chip select decoding n Active HIGH mutually exclusive outputs n Multiple package options n Complies with JEDEC standard no. 7A n ESD protection: u HBM JESD22-A114E exceeds 2000 V u MM JESD22-A115-A exceeds 200 V n Specied from - 40 Cto+85 C and from - 40 C to +125 C74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC238N - 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HC238D - 40 C to +125 C SO16 plastic small outline package; 16 leads; SOT109-1 body width 3.9 mm 74HC238DB - 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; SOT338-1 body width 5.3 mm 74HC238PW - 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; SOT403-1 body width 4.4 mm 74HC238BQ - 40 C to +125 C DHVQFN16 plastic dual in-line compatible thermal enhanced very thin SOT763-1 quad at package; no leads; 16 terminals; body 2.5 3.5 0.85 mm 74HCT238N - 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HCT238D - 40 C to +125 C SO16 plastic small outline package; 16 leads; SOT109-1 body width 3.9 mm 74HCT238DB - 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; SOT338-1 body width 5.3 mm 74HCT238PW - 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; SOT403-1 body width 4.4 mm 74HCT238BQ - 40 C to +125 C DHVQFN16 plastic dual in-line compatible thermal enhanced very thin SOT763-1 quad at package; no leads; 16 terminals; body 2.5 3.5 0.85 mm 4. Functional diagram 15 Y0 14 Y1 15 Y0 13 1 Y2 14 Y1 A0 12 2 Y3 13 Y2 3 TO 8 ENABLE A1 A0 1 11 DECODER EXITING 3 Y4 12 Y3 3 TO 8 ENABLE A2 A1 2 10 DECODER EXITING Y5 11 Y4 A2 3 9 Y6 10 Y5 7 Y7 9 Y6 7 Y7 4 E1 5 4 E2 E1 6 5 E3 E2 6 E3 001aag752 001aag753 Fig 1. Logic symbol Fig 2. Functional diagram 74HC_HCT238_3 NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 16 July 2007 2 of 18