Product Information

MC33PF8100CFESR2

MC33PF8100CFESR2 electronic component of NXP

Datasheet
Power Management Specialised - PMIC Power Management IC i.MX8 pre-prog 7 buck 4 LDO Auto QFN 56
Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

4000: USD 8.6869 ea
Line Total: USD 34747.6

0 - Global Stock
MOQ: 4000  Multiples: 4000
Pack Size: 4000

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Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 4000
Multiples : 4000
4000 : USD 7.9852

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Additional Infomation About Product

PF8100 PF8200 12-channel power management integrated circuit for high performance applications Rev. 11 24 February 2021 Product data sheet 1 Overview The PF8100/PF8200 is a power management integrated circuit (PMIC) designed for high performance i.MX 8 and S32x based applications. It features seven high efficiency buck converters and four linear regulators for powering the processor, memory and miscellaneous peripherals. Built-in one time programmable memory stores key startup configurations, drastically reducing external components typically used to set output voltage and sequence of 2 external regulators. Regulator parameters are adjustable through high-speed I C after start up offering flexibility for different system states. 2 Features Up to seven high efficiency buck converters Four linear regulators with load switch options RTC supply and coin cell charger Watchdog timer/monitor Monitoring circuit to fit ASIL B safety level One time programmable device configuration 2 3.4 MHz I C communication interface 56-pin 8 x 8 QFN packageNXP Semiconductors PF8100 PF8200 12-channel power management integrated circuit for high performance applications 3 Simplified application diagram PF8x00 PF8x00 PF8x00 IMX8QXP VSNVS VDD SNVS IMX8QM VSNVS VSNVS VDD SNVS BUCK1 BUCK1 BUCK1 VDD MAIN VDD MAIN GPU0 VDD MEMC BUCK2 VIN: BUCK2 BUCK2 VIN: VIN: 2.7 V to 2.7 V to 2.7 V to 5.5 V BUCK3 VDD GPU 5.5 V 5.5 V BUCK3 BUCK3 CPU1 GPU1 (A72) VDD CPU (A35) BUCK4 BUCK4 BUCK4 BUCK5 VDD DDRIO BUCK5 CPU0 (A53) VDD MEMC BUCK5 1.8 V I/O BUCK6 BUCK6 VDD DDRIO0 VDD DDRIO1 BUCK6 (LV GPIO) 3.3 V I/O BUCK7 BUCK7 1.8 V I/O 3.3 V I/O BUCK7 (HV GPIO) LDO1 VDD SCU LDO1 VDD SCU VDD SIM LDO1 LDO2 SDCARD0 LDO2 SDCARD0 SDCARD1 LDO2 LDO3 2.5 V I/O LDO3 3.3 V I/O 2.5 V I/O LDO3 LDO4 MISC LDO4 MISC MISC LDO4 CONTROL CONTROL CONTROL INTERFACING AND INTERFACING AND SIGNALS 2 SIGNALS 2 SIGNALS I C COMMUNICATIONS I C COMMUNICATIONS 2 2 2 I C I C I C SIMCARD eMMC Supply SIMCARD Ethernet SD Card SD Card eMMC Supply SD Card Ethernet DRAM DRAM DRAM LPDDR LPDDR 0 LPDDR 1 MISCELLANEOUS MISCELLANEOUS Memory Memory Memory PERIPHERALS PERIPHERALS aaa-028047 Figure 1.Simplified application diagram 4 Ordering information Table 1.Device options Type Package Name Description Version PF8100 (automotive) HVQFN56, plastic, thermally enhanced very thin quad flat non-leaded package, SOT684-21 wettable flanks 56 terminals 0.5 mm pitch 8 mm x 8 mm x 0.85 mm body (DD/SC) PF8200 (automotive) HVQFN56 PF8100 (industrial) HVQFN56, plastic, thermally enhanced very thin quad flat non-leaded package, SOT684-21 56 terminals 0.5 mm pitch 8 mm x 8 mm x 0.85 mm body Table 2.Ordering information 1 Part number Target market NXP processor System comments Safety grade OTP ID MC33PF8100A0ES Automotive n/a Not programmed QM n/a 2 MC33PF8100CCES Automotive i.MX8QXP LPDDR4 memory QM

HS Compliance

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:

NXP may also be referenced as

FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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