Document Number MC56F81XXX NXP Semiconductors Rev. 1.1, 12/2020 Data Sheet: Technical Data MC56F81XXX MC56F81xxx Supports MC56F81xxx Features One high resolution eFlexPWM module with up to 12 PWM outputs, including 8 channels with 312ps This family of digital signal controllers (DSCs) is resolution NanoEdge placement based on the 32-bit 56800EX core. On a single chip, each device combines the processing power of a DSP Communication interfaces and the functionality of an MCU, with a flexible set of Up to two high-speed queued SCI (QSCI) modules peripherals to support many target applications: with LIN slave functionality Industrial control One queued SPI (QSPI) modules Motion control Up to two LPI2C modules (Support Full PMBus) Home appliances Timers General-purpose inverters One 16-bit quad timer (1 x 4 16-bit timer) Smart sensors, fire and security systems Two 32-bit Periodic Interval Timers (PITs) Wireless charging One Quadrature Decoder (QDC) Switched-mode power supply and power management Security and integrity Uninterruptible power supplies (UPS) Cyclic Redundancy Check (CRC) generator Solar inverter Windowed Computer operating properly (COP) Medical monitoring applications watchdog External Watchdog Monitor (EWM) DSC based on 32-bit 56800EX core Up to 100 MIPS at 100 MHz core frequency in fast Clocks mode On-chip oscillators: 200 kHz, and 8/2MHz IRC DSP and MCU functionality in a unified, C-efficient Crystal / resonator oscillator architecture System On-chip memory 4-channel enhanced DMA controller, supporting up Up to 128 KB flash memory to 63 request sources Up to 20 KB data/program RAM Integrated power-on reset (POR) and low-voltage Both on-chip flash memory and RAM can be interrupt (LVI) and brown-out reset module mapped into both program and data memory spaces Inter-Module Crossbar and Event Generator Boot ROM (supports boot from SCI, I2C) JTAG/enhanced on-chip emulation (EOnCE) for unobtrusive, real-time debugging Analog Two high-speed, 12-bit ADCs with dynamic x1, x2, Operating characteristics and x4 programmable amplifier Single supply: 2.7 V to 3.6 V Two operational amplifiers, programmable gain up Operation ambient temperature (V): -40 to 105C to x16 Operation ambient temperature (M): -40 to 125C Up to four analog comparators with integrated 8-bit 64-pin LQFP, 48-pin LQFP, 32-pin LQFP and QFN DAC references packages One 12-bit digital-to-analog converters (DAC) On-chip temperature sensors NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Overview............................................................................................3 8.8 Definition: Typical value........................................................ 37 1.1 Product Family........................................................................ 3 8.9 Typical value conditions......................................................... 38 1.2 56800EX 32-bit Digital Signal Controller (DSC) core...........4 9 Ratings................................................................................................38 1.3 Operation Parameters.............................................................. 4 9.1 Thermal handling ratings........................................................ 38 1.4 Interrupt Controller................................................................. 5 9.2 Moisture handling ratings........................................................38 1.5 Peripheral highlights............................................................... 5 9.3 ESD handling ratings.............................................................. 38 1.6 System Block Diagram............................................................13 9.4 Voltage and current operating ratings..................................... 39 2 MC56F81xxx signal and pin descriptions..........................................15 10 General............................................................................................... 39 3 Signal groups......................................................................................25 10.1 General characteristics............................................................ 39 4 Pinout................................................................................................. 26 10.2 AC electrical characteristics....................................................40 4.1 Signal Multiplexing and Pin Assignments..............................26 10.3 Nonswitching electrical specifications....................................41 4.2 Pinout diagrams.......................................................................28 10.4 Switching specifications..........................................................47 5 Ordering parts.....................................................................................31 10.5 Thermal specifications............................................................ 47 5.1 Determining valid orderable parts...........................................31 11 Peripheral operating requirements and behaviors..............................49 5.2 Part number list....................................................................... 31 11.1 Core modules...........................................................................49 6 Part identification...............................................................................32 11.2 System modules.......................................................................50 6.1 Description.............................................................................. 32 11.3 Clock modules.........................................................................50 6.2 Format..................................................................................... 32 11.4 Memories and memory interfaces........................................... 53 6.3 Fields....................................................................................... 32 11.5 Analog..................................................................................... 55 6.4 Example...................................................................................33 11.6 PWMs and timers....................................................................61 7 Package marking information............................................................ 33 11.7 Communication interfaces.......................................................62 8 Terminology and guidelines...............................................................34 12 Design Considerations....................................................................... 67 8.1 Definition: Operating requirement.......................................... 34 12.1 Thermal design considerations................................................67 8.2 Definition: Operating behavior............................................... 34 12.2 Electrical design considerations.............................................. 69 8.3 Definition: Attribute................................................................35 12.3 Power-on Reset design considerations....................................70 8.4 Definition: Rating....................................................................35 13 Obtaining package dimensions.......................................................... 71 8.5 Result of exceeding a rating.................................................... 35 14 Product documentation.......................................................................72 8.6 Relationship between ratings and operating requirements......36 15 Revision history................................................................................. 72 8.7 Guidelines for ratings and operating requirements................. 36 MC56F81xxx, Rev. 1.1, 12/2020 2 NXP Semiconductors