Document Number MC9S08PA4 NXP Semiconductors Rev. 10, 03/2020 Data Sheet: Technical Data MC9S08PA4 MC9S08PA4 Data Sheet Supports: MC9S08PA4(A) Key features Development support Single-wire background debug interface 8-Bit S08 central processor unit (CPU) Breakpoint capability to allow three breakpoints Up to 20 MHz bus at 2.7 V to 5.5 V across operating setting during in-circuit debugging temperature range On-chip in-circuit emulator (ICE) debug module Supporting up to 40 interrupt/reset sources containing two comparators and nine trigger modes Supporting up to four-level nested interrupt On-chip memory Peripherals Up to 4 KB flash read/program/erase over full ACMP - one analog comparator with both positive operating voltage and temperature and negative inputs separately selectable interrupt Up to 128 byte EEPROM 2-byte erase sector on rising and falling comparator output filtering program and erase while executing flash ADC - 8-channel, 12-bit resolution 2.5 s Up to 512 byte random-access memory (RAM) conversion time data buffers with optional Flash and RAM access protection watermark automatic compare function internal bandgap reference channel operation in stop mode Power-saving modes optional hardware trigger One low-power stop mode reduced power wait FTM - Three 2-channel flex timer modulators mode modules 16-bit counter each channel can be Peripheral clock enable register can disable clocks to configured for input capture, output compare, edge- unused modules, reducing currents allows clocks to or center-aligned PWM mode remain enabled to specific peripherals in stop3 mode RTC - 16-bit real timer counter (RTC) Clocks SCI - one serial communication interface (SCI/ Oscillator (XOSC) - loop-controlled Pierce UART) modules optional 13-bit break full duplex oscillator crystal or ceramic resonator range of non-return to zero (NRZ) LIN extension support 31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz Input/Output Internal clock source (ICS) - containing a frequency- Up to 18 GPIOs including one output-only pin locked-loop (FLL) controlled by internal or external One 8-bit keyboard interrupt module (KBI) reference precision trimming of internal reference Two, ultra-high current sink pins supporting 20 mA allowing 1% deviation across temperature range of 0 source/sink current C to 70 C and 2% deviation across whole operating temperature range up to 20 MHz Package options 20-pin SOIC System protection 20-pin TSSOP Watchdog with independent clock source 16-pin TSSOP Low-voltage detection with reset or interrupt 8-pin DFN selectable trip points 8-pin SOIC Illegal opcode detection with reset Illegal address detection with reset NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 MCU block diagram...........................................................................3 6.2 Switching specifications............................................................ 16 2 Orderable part numbers......................................................................4 6.2.1 Control timing..............................................................16 3 Part identification...............................................................................4 6.2.2 Debug trace timing specifications................................17 3.1 Description.................................................................................4 6.2.3 FTM module timing.....................................................18 3.2 Format........................................................................................4 6.3 Thermal specifications...............................................................19 3.3 Fields..........................................................................................5 6.3.1 Thermal characteristics................................................ 19 3.4 Example..................................................................................... 5 7 Peripheral operating requirements and behaviors..............................20 4 Parameter Classification.....................................................................5 7.1 External oscillator (XOSC) and ICS characteristics..................20 5 Ratings................................................................................................6 7.2 NVM specifications...................................................................21 5.1 Thermal handling ratings...........................................................6 7.3 Analog........................................................................................23 5.2 Moisture handling ratings..........................................................6 7.3.1 ADC characteristics..................................................... 23 5.3 ESD handling ratings.................................................................6 7.3.2 Analog comparator (ACMP) electricals...................... 25 5.4 Voltage and current operating ratings........................................7 8 Dimensions.........................................................................................26 6 General............................................................................................... 8 8.1 Obtaining package dimensions..................................................26 6.1 Nonswitching electrical specifications...................................... 8 9 Pinout................................................................................................. 26 6.1.1 DC characteristics........................................................ 8 9.1 Signal multiplexing and pin assignments.................................. 26 6.1.2 Supply current characteristics...................................... 14 9.2 Device pin assignment...............................................................27 6.1.3 EMC performance........................................................15 10 Revision history................................................................................. 28 MC9S08PA4 Data Sheet, Rev. 10, 03/2020 2 NXP Semiconductors