Product Information

MCF53015CMJ240J

MCF53015CMJ240J electronic component of NXP

Datasheet
MPU ColdFire MCF5301x Processor RISC 32bit 240MHz 3.3V 256-Pin MAP-BGA Tray

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

450: USD 21.4088 ea
Line Total: USD 9633.96

0 - Global Stock
MOQ: 450  Multiples: 450
Pack Size: 450
     
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Freescale Semiconductor Document Number: MCF53017 Rev. 5, 3/2010 Data Sheet: Advance Information MCF53017 LQFP208 MAPBGA256 28 x 28 17 x 17 MCF5301x Data Sheet Features Version 3 ColdFire core with EMAC Up to 211 Dhrystone 2.1 MIPS @ 240 MHz 16 KBytes unified instruction/data cache 128 KBytes internal SRAM with standby power supply support Crossbar switch technology (XBS) for concurrent access to peripherals or RAM from multiple bus masters Enhanced Secure Digital Host Controller (eSDHC) Supports CE-ATA, SD Memory, miniSD Memory, SDIO, miniSDIO, SD Combo, MMC, MMC plus, MMC 4x, and MMC RS cards Two ISO7816 smart card interfaces IC identification module Voice-band audio codec with integrated speaker, microphone, headphone, and handset amplifiers 16- or 32-bit SDR, 16-bit DDR/mobile-DDR SDRAM controller USB 2.0 On-the-Go controller USB host controller 2 10/100 Ethernet MACs Coprocessor for acceleration of the DES, 3DES, AES, MD5, and SHA-1 algorithms Random number generator 16-channel DMA controller Synchronous serial interface 4 periodic interrupt timers 4 32-bit timers with DMA support Real-time clock (RTC) module with standby support DMA-supported serial peripheral interface (DSPI) 3 UARTs 2 I C bus interface This document contains information on a new product. Specifications and information herein are subject to change without notice. Freescale Semiconductor, Inc., 2010. All rights reserved. PreliminarySubject to Change Without NoticeTable of Contents 1 MCF5301x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . .4 5.11 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 34 2 2 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 5.12 I C Input/Output Timing Specifications . . . . . . . . . . . . 35 3 Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .5 5.13 Fast Ethernet AC Timing Specifications . . . . . . . . . . . 37 3.1 PLL Power Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 5.13.1 Receive Signal Timing Specifications . . . . . . . 37 3.2 USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 5.13.2 Transmit Signal Timing Specifications . . . . . . . 37 3.3 Supply Voltage Sequencing . . . . . . . . . . . . . . . . . . . . . .6 5.13.3 Asynchronous Input Signal Timing Specifications38 3.3.1 Power Up Sequence . . . . . . . . . . . . . . . . . . . . . .7 5.13.4 MII Serial Management Timing Specifications . 38 3.3.2 Power Down Sequence . . . . . . . . . . . . . . . . . . . .7 5.14 32-Bit Timer Module Timing Specifications . . . . . . . . . 39 3.4 Power Consumption Specifications. . . . . . . . . . . . . . . . .8 5.15 DSPI Timing Specifications . . . . . . . . . . . . . . . . . . . . . 39 4 Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .9 5.16 eSDHC Electrical Specifications . . . . . . . . . . . . . . . . . 41 4.1 Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 5.16.1 eSDHC Timing . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.2 Pinout208 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 5.16.2 eSDHC Electrical DC Characterisics . . . . . . . . 42 4.3 Pinout256 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . . .18 5.17 SIM Electrical Specifications . . . . . . . . . . . . . . . . . . . . 43 5 Preliminary Electrical Characteristics . . . . . . . . . . . . . . . . . . .19 5.17.1 General Timing Requirements . . . . . . . . . . . . . 43 5.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 5.17.2 Reset Sequence. . . . . . . . . . . . . . . . . . . . . . . . 44 5.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .20 5.17.3 Power Down Sequence . . . . . . . . . . . . . . . . . . 45 5.3 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 5.18 IIM/Fusebox Electrical Specifications . . . . . . . . . . . . . 46 5.4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .21 5.19 Voice Codec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 5.4.1 PLL Power Filtering . . . . . . . . . . . . . . . . . . . . . .22 5.19.1 Voice Codec ADC Specifications . . . . . . . . . . . 47 5.4.2 USB Power Filtering. . . . . . . . . . . . . . . . . . . . . .22 5.19.2 Voice Codec DAC Specifications . . . . . . . . . . . 51 5.4.3 Supply Voltage Sequencing and Separation 5.20 Integrated Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Cautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 5.20.1 Speaker Amplifier. . . . . . . . . . . . . . . . . . . . . . . 55 5.5 Oscillator and PLL Electrical Characteristics . . . . . . . .24 5.20.2 Handset Amplifier. . . . . . . . . . . . . . . . . . . . . . . 56 5.6 External Interface Timing Characteristics . . . . . . . . . . .25 5.20.3 Headphone Amplifier . . . . . . . . . . . . . . . . . . . . 57 5.6.1 FlexBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 5.20.4 Microphone Amplifier . . . . . . . . . . . . . . . . . . . . 57 5.7 SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 5.21 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 58 5.7.1 SDR SDRAM AC Timing Characteristics. . . . . .27 5.22 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . 60 5.7.2 DDR SDRAM AC Timing Characteristics . . . . .30 6 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 5.8 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . .32 7 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 5.9 Reset and Configuration Override Timing. . . . . . . . . . .33 8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 5.10 USB On-The-Go . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 MCF5301x Data Sheet, Rev. 5 2 PreliminarySubject to Change Without Notice Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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