Freescale Semiconductor Document Number: MPC5125 Rev. 4 , 09/2011 Data Sheet: Technical Data MPC5125 324 TEPBGA 23 mm x 23 mm MPC5125 Microcontroller Data Sheet The MPC5125 integrates a high performance e300 CPU core based on the Power Architecture Technology with a rich set of peripheral functions focused on communications and systems integration. Major features of the MPC5125 are as follows: e300 Power Architecture processor core (enhanced version of the MPC603e core), operates as fast as 400 MHz Low power design Display interface unit (DIU) DDR1, DDR2, low-power mobile DDR (LPDDR), and 1.8 V/3.3 V SDR DRAM memory controllers 32 KB on-chip SRAM USB 2.0 OTG controller with ULPI interface DMA subsystem Flexible multi-function external memory bus (EMB) interface NAND flash controller (NFC) LocalPlus interface (LPC) 10/100Base Ethernet MMC/SD/SDIO card host controller (SDHC) Programmable serial controller (PSC) 2 Inter-integrated circuit (I C) communication interfaces Controller area network (CAN) J1850 byte data link controller (BDLC) interface On-chip real-time clock (RTC) On-chip temperature sensor IC Identification module (IIM) Freescale Semiconductor, Inc., 20082011. All rights reserved.Table of Contents 1 Ordering Information .3 4.3.7 NFC . 61 2 MPC5125 Block Diagrams 4 4.3.8 FEC . 63 3 Pin Assignments 5 4.3.9 USB ULPI . 66 3.1 324-ball TEPBGA Pin Assignments 5 4.3.10 MMC/SD/SDIO Card Host Controller (SDHC) . 67 3.2 Pin Muxing and Reset States .6 4.3.11 DIU 68 3.2.1 Power and Ground Supply Summary 35 4.3.12 CAN . 71 2 4 Electrical and Thermal Characteristics 36 4.3.13 I C 71 4.1 DC Electrical Characteristics 36 4.3.14 J1850 72 4.1.1 Absolute Maximum Ratings 36 4.3.15 PSC . 72 4.1.2 Recommended Operating Conditions 36 4.3.16 GPIOs and Timers 79 4.1.3 DC Electrical Specifications 37 4.3.17 Fusebox 79 4.1.4 Electrostatic Discharge .40 4.3.18 IEEE 1149.1 (JTAG) . 80 4.1.5 Power Dissipation .41 5 System Design Information 82 4.1.6 Thermal Characteristics .42 5.1 Power Up/Down Sequencing 82 4.2 Oscillator and PLL Electrical Characteristics 43 5.2 System and CPU Core AV Power Supply Filtering . 82 DD 4.2.1 System Oscillator Electrical Characteristics .44 5.3 Connection Recommendations 82 4.2.2 RTC Oscillator Electrical Characteristics 44 5.4 Pullup/Pulldown Resistor Requirements . 83 4.2.3 System PLL Electrical Characteristics 45 5.4.1 Pulldown Resistor Requirements for TEST Pin 83 4.2.4 e300 Core PLL Electrical Characteristics .45 5.5 JTAG 83 4.3 AC Electrical Characteristics .46 5.5.1 JTAG TRST . 83 4.3.1 Overview 46 5.5.2 e300 COP / BDM Interface 83 4.3.2 AC Operating Frequency Data 46 6 Package Information . 87 4.3.3 Resets 47 6.1 Package Parameters . 87 4.3.4 External Interrupts .50 6.2 Mechanical Dimensions 88 4.3.5 SDRAM (DDR) .50 7 Product Documentation . 91 4.3.6 LPC 55 8 Revision History 91 MPC5125 Microcontroller Data Sheet, Rev. 4 2 Freescale Semiconductor