Product Information

NCX8200UKZ

NCX8200UKZ electronic component of NXP

Datasheet
Switch ICs - Various Audio jack config switch matrix

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - Global Stock

MOQ : 4000
Multiples : 4000
4000 : USD 0.3937
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
On Resistance - Max
Supply Voltage - Max
Supply Voltage - Min
Maximum Operating Temperature
Minimum Operating Temperature
Minimum Operating Temperature
Packaging
Number of Switches
Configuration
Package / Case
Mounting Style
Height
Length
Width
Brand
Off Time - Max
On Time - Max
Pd - Power Dissipation
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
Taric
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NCX8200 Audio jack configuration switch matrix Rev. 1 15 May 2015 Product data sheet 1. General description The NCX8200 is an advanced audio jack configuration switch matrix device that supports 3- and 4-pole connectors. It allows reconfiguration of the GND, microphone-bias contact to comply with the American Headset Jack (AHJ) and the Open Mobile Terminal Platform (OMTP) pinout. Furthermore, a GND sense path supports quasi-differential amplifier architectures. The device contains Human Body Model compliant ESD protection diodes rated 8 kV at all pins. The device can be operated from a supply in the range of 1.6 V to 3.6 V. It supports a broad variety of after-market headphones. 2. Features and benefits AHJ and OMTP headset jack pinout support Low supply current Sense path to GND for quasi differential amplifier configuration Low THD and noise microphone pass through channel Ultra low R of ground and sense switches DSon High power supply ripple rejection ESD protection: HBM JEDEC JDS-001 Class 3B exceeds 8 kV Operating ambient temperature: 40 C to +85C 1.22 mm 1.22 mm 0.5 mm WLCSP9 package 3. Applications Headphones with integrated microphone and remote control buttons 4. Ordering information Table 1. Ordering information Type number Package Name Description Version NCX8200UK WLCSP9 wafer chip-scale package 9 bumps 1.22 1.22 0.5 mm NCX8200UK 5. Marking Table 2. Marking codes Type number Marking code NCX8200UK qx82NCX8200 NXP Semiconductors Audio jack configuration switch matrix 6. Functional diagram AHJ GND MIC OMTP MIC GND VDD headset jack SNS 1 SNS1 L R Sense 2 SNS2 1 CON1 R MIB bias MIC 2 CON2 C MIC 1 2 SEL GRD 750 k GND aaa-016470 Default configuration with SEL = L is AHJ-compliant in this example. Fig 1. Simplified schematic NCX8200 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 1 15 May 2015 2 of 14

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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