Product Information

SC18IS600IBS,151

SC18IS600IBS,151 electronic component of NXP

Datasheet
I/O Controller Interface IC SPI to I2C Bus Interface 24-Pin
Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1

MOQ : 490
Multiples : 1
490 : USD 1.7316
490 : USD 1.7316
490 : USD 1.7316
490 : USD 1.6029
1960 : USD 1.4742
4410 : USD 1.404
N/A

Obsolete
0 - WHS 2


Multiples : 980
N/A

Obsolete
0 - WHS 3

MOQ : 1
Multiples : 1
1 : USD 1.8078
10 : USD 1.6029
100 : USD 1.3981
500 : USD 1.3137
1000 : USD 1.1631
2500 : USD 1.1389
5000 : USD 1.1389
10000 : USD 1.0956
25000 : USD 1.0522
N/A

Obsolete

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Additional Infomation About Product

SC18IS600 2 SPI to I C-bus interface Rev. 8 9 October 2019 Product data sheet 1. General description The SC18IS600 is designed to serve as an interface between the standard SPI of a host 2 (microcontroller, microprocessor, chip set, etc.) and the serial I C-bus. This allows the 2 host to communicate directly with other I C-bus devices. The SC18IS600 can operate as 2 2 an I C-bus master-transmitter or master-receiver. The SC18IS600 controls all the I C-bus specific sequences, protocol, arbitration and timing. 2. Features and benefits SPI slave interface SPI Mode 3 2 Single master I C-bus controller Four General Purpose Input/Output (GPIO) pins Two quasi-bidirectional I/O pins 5 V tolerant I/O pins High-speed SPI: Up to 1.2 Mbit/s 2 High-speed I C-bus: 400 kbit/s 96-byte transmit buffer 96-byte receive buffer 2.4 V to 3.6 V operation Power-down mode with WAKEUP pin Internal oscillator Active LOW interrupt output Available in TSSOP16 packageSC18IS600 NXP Semiconductors 2 SPI to I C-bus interface 3. Ordering information Table 1. Ordering information Type number Topside Package marking Name Description Version SC18IS600IPW/S8 18IS600 TSSOP16 plastic thin shrink small outline package 16 leads SOT403-1 body width 4.4 mm 3.1 Ordering options Table 2. Ordering options Type number Orderable part number Package Packing method Minimum Temperature order quantity 1 SC18IS600IPW/S8 SC18IS600IPW/S8HP TSSOP16 REEL 13 Q4/T2 2500 T = 40 C to +85 C amb *STANDARD MARK SMD 1 NXP plans to supply the /S8 device with an expected discontinuation in the 2024-2025 timeframe, but in the meantime, Failure Analysis for /S8 devices will consist of Automated Test Equipment (ATE) and electrical overstress verification along with package and wire bond validation only. Detailed device failure analysis will not be available refer to CIN 201708035I. SC18IS600 All information provided in this document is subject to legal disclaimers. NXP B.V. 2019. All rights reserved. Product data sheet Rev. 8 9 October 2019 2 of 28

HS Compliance

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits

NXP may also be referenced as

FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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