SPC5746RK1MMT5 NXP

SPC5746RK1MMT5 electronic component of NXP
SPC5746RK1MMT5 NXP
SPC5746RK1MMT5 32-bit Microcontrollers - MCU
SPC5746RK1MMT5 Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of SPC5746RK1MMT5 32-bit Microcontrollers - MCU across the USA, India, Europe, Australia, and various other global locations. SPC5746RK1MMT5 32-bit Microcontrollers - MCU are a product manufactured by NXP. We provide cost-effective solutions for 32-bit Microcontrollers - MCU, ensuring timely deliveries around the world.

Part No. SPC5746RK1MMT5
Manufacturer: NXP
Category: 32-bit Microcontrollers - MCU
Description: 32-bit Microcontrollers - MCU NXP 32-bit MCU, Dual Power Arch core, 4MB Flash, 200MHz, -40/+125degC, Automotive Qual,MAP 252
Datasheet: SPC5746RK1MMT5 Datasheet (PDF)
Price (USD)
1: USD 39.1959 ea
Line Total: USD 39.2 
Availability : 14
  
Ship by Tue. 26 Aug to Fri. 29 Aug
QtyUnit Price
1$ 39.1959
30$ 37.1328

Availability 14
Ship by Tue. 26 Aug to Fri. 29 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 39.1959
30$ 37.1328

   
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We are delighted to provide the SPC5746RK1MMT5 from our 32-bit Microcontrollers - MCU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the SPC5746RK1MMT5 and other electronic components in the 32-bit Microcontrollers - MCU category and beyond.

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Document Number MPC5746R NXP Semiconductors Rev. 7, 02/2020 Data Sheet: Technical Data MPC5746R SPC5746R Microcontroller Data Sheet Features For functional characteristics, see the MPC5746R Microcontroller Reference Manual. This document provides electrical specifications, pin assignments, and package diagrams for the MPC5746R series of microcontroller units (MCUs). NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Introduction........................................................................................3 17.2 Flash memory Array Integrity and Margin Read 1.1 Block diagram......................................................................... 3 specifications...........................................................................55 2 Package pinouts and signal descriptions............................................5 17.3 Flash memory module life specifications................................55 3 Absolute maximum ratings................................................................ 6 17.4 Data retention vs program/erase cycles...................................56 4 Electromagnetic Compatibility (EMC)..............................................7 17.5 Flash memory AC timing specifications.................................57 5 Electrostatic discharge (ESD)............................................................ 7 17.6 Flash read wait state and address pipeline control settings.....58 6 Operating conditions.......................................................................... 8 18 AC specifications............................................................................... 58 7 DC electrical specifications................................................................11 18.1 Debug and calibration interface timing...................................58 8 I/O pad specification.......................................................................... 12 18.1.1 JTAG interface timing............................................ 58 8.1 Input pad specifications...........................................................12 18.1.2 Nexus interface timing............................................61 8.2 Output pad specifications........................................................15 18.1.3 Aurora LVDS interface timing............................... 63 8.3 I/O pad current specifications................................................. 17 18.2 DSPI timing with CMOS and LVDS...................................... 65 9 Reset pad (PORST, RESET) electrical characteristics...................... 18 18.2.1 DSPI master mode full duplex timing with CMOS 10 Oscillator and FMPLL....................................................................... 22 and LVDS pads.......................................................66 11 ADC modules.....................................................................................26 18.2.2 DSPI CMOS slave mode........................................ 78 11.1 ADC input description............................................................ 26 18.3 FEC timing.............................................................................. 80 11.2 SAR ADC................................................................................26 18.3.1 MII-lite receive signal timing (RXD 3:0 , 11.3 S/D ADC................................................................................. 29 RX DV, RX ER, and RX CLK)...........................80 12 Temperature sensor............................................................................ 39 18.3.2 MII-lite transmit signal timing (TXD 3:0 , 13 LVDS fast asynchronous serial transmission (LFAST) pad TX EN, TX ER, TX CLK)...................................81 electrical characteristics..................................................................... 40 18.3.3 MII-lite async inputs signal timing (CRS and 13.1 LFAST interface timing diagrams...........................................40 COL)....................................................................... 82 13.2 LFAST and MSC /DSPI LVDS interface electrical 18.3.4 MII-lite serial management channel timing characteristics.......................................................................... 42 (MDIO and MDC).................................................. 82 14 LFAST PLL electrical characteristics................................................45 18.3.5 RMII serial management channel timing (MDIO 15 Aurora LVDS electrical characteristics............................................. 46 and MDC)............................................................... 83 16 Power management PMC POR LVD sequencing..............................47 18.3.6 RMII receive signal timing (RXD 1:0 , CRS DV)84 16.1 Power management electrical characteristics..........................47 18.3.7 RMII transmit signal timing (TXD 1:0 , TX EN). 85 16.1.1 Recommended power transistors............................ 47 18.4 UART timings.........................................................................86 16.1.2 Power management integration.............................. 48 18.5 eMIOS timing..........................................................................86 16.1.3 Regulator example for the NJD2873 transistor...... 50 19 Obtaining package dimensions.......................................................... 86 16.1.4 Regulator example for the 2SCR574d transistor.... 51 20 Thermal characteristics...................................................................... 87 16.1.5 Device voltage monitoring......................................51 20.1 General notes for specifications at maximum junction 16.1.6 Power up/down sequencing.................................... 53 temperature..............................................................................89 17 Flash memory specifications..............................................................54 21 Ordering information......................................................................... 90 17.1 Flash memory program and erase specifications.................... 54 22 Revision history................................................................................. 91 SPC5746R Microcontroller Data Sheet, Rev. 7, 02/2020 2 NXP Semiconductors

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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