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XC7SET125GM

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IC, BUFFER/LINE DRIVER, 3-ST, XSON6

Manufacturer: NXP

This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1: USD 0.1131 ea
Line Total: USD 0.11

0 - Global Stock

MOQ: 1 Multiples: 1
Pack Size: 1

More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 - WHS 1 Ships to you between Thu. 23 May to Wed. 29 May MOQ : 1 Multiples : 1 XC7SET125GM NXP	1 : USD 0.1131

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Additional Infomation About Product

AN10343 MicroPak soldering information Rev. 2 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land patterns for mounting MicroPak packagesAN10343 NXP Semiconductors MicroPak soldering information Revision history Rev Date Description v.2 20101230 text and graphics updated to latest standards Contact information For more information, please visit:

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Manufacturer NXP NXP
Product Category Unclassified Unclassified
Logic Device Type Buffer / Line Driver, Non Inverting Buffer / Line Driver, Non Inverting
Logic Case Style Xson Xson
No Of Pins 6 6
Supply Voltage Min 4.5 V 4.5 V
Supply Voltage Max 5.5 V 5.5 V
Operating Temperature Min - 40 C - 40 C
Operating Temperature Max 125 C 125 C
Packaging Each Each
Msl Msl 1 - Unlimited Msl 1 - Unlimited
Svhc No Svhc (15 - Jun - 2015) No Svhc (15 - Jun - 2015)
Operating Temperature Range - 40 C To + 125 C - 40 C To + 125 C
Supply Voltage Range 4.5 V To 5.5 V 4.5 V To 5.5 V