XC7WH14GT NXP

XC7WH14GT electronic component of NXP
XC7WH14GT NXP
XC7WH14GT Unclassified
XC7WH14GT
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of XC7WH14GT across the USA, India, Europe, Australia, and various other global locations. XC7WH14GT are a product manufactured by NXP. We provide cost-effective solutions for XC7WH14GT, ensuring timely deliveries around the world.

Part No.XC7WH14GT
Manufacturer:NXP
Category:Unclassified
Description:IC, INV, SCHMITT TRIGGER, XSON8
Datasheet:XC7WH14GT Datasheet (PDF)
Shipping Charges:Click here for details
AI Image
Price (USD)
  
1: USD 0.5853 ea
Line Total: USD 0.59 
Availability : 0
  
QtyUnit Price
1$ 0.5853
10$ 0.4939
100$ 0.3748
250$ 0.3405
500$ 0.3069
  

Availability0
Ship by Tue. 23 Jun to Mon. 29 Jun
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 0.5853
10$ 0.4939
100$ 0.3748
250$ 0.3405
500$ 0.3069

   
Manufacturer
Product Category
Brand
Logic Type
No. Of Inputs
Supply Voltage Min
Supply Voltage Max
Logic Case Style
No. Of Pins
Logic Ic Family
Operating Temperature Min
Operating Temperature Max
Rohs Phthalates Compliant
Msl
Svhc
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We are delighted to provide the XC7WH14GT from our NXP manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the XC7WH14GT and other electronic components in the NXP manufacturer and beyond.

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AN10343 MicroPak soldering information Rev. 2 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land patterns for mounting MicroPak packagesAN10343 NXP Semiconductors MicroPak soldering information Revision history Rev Date Description v.2 20101230 text and graphics updated to latest standards Contact information For more information, please visit:

Freescale
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Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
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PHI
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