Product Information

BVSS138LT1G

BVSS138LT1G electronic component of ON Semiconductor

Datasheet
ON Semiconductor MOSFET NFET 50V 200MA 3.5O

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

3000: USD 0.0529 ea
Line Total: USD 158.7

26190 - Global Stock
Ships to you between
Fri. 24 May to Thu. 30 May
MOQ: 3000  Multiples: 3000
Pack Size: 3000
Availability Price Quantity
1292040 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 3000
Multiples : 3000

Stock Image

BVSS138LT1G
ON Semiconductor

3000 : USD 0.0751
333000 : USD 0.0736

26190 - WHS 2


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 3000
Multiples : 3000

Stock Image

BVSS138LT1G
ON Semiconductor

3000 : USD 0.0529
6000 : USD 0.0519

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs - Gate-Source Breakdown Voltage
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Configuration
Series
Brand
Forward Transconductance - Min
Ciss - Input Capacitance
Factory Pack Quantity :
Typical Turn-Off Delay Time
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BSS138L, BVSS138L Power MOSFET 200 mA, 50 V NChannel SOT23 Typical applications are DCDC converters, power management in www.onsemi.com portable and batterypowered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. 200 mA, 50 V Features R = 3.5 DS(on) Low Threshold Voltage (V : 0.85 V1.5 V) Makes it Ideal for GS(th) Low Voltage Applications NChannel 3 Miniature SOT23 Surface Mount Package Saves Board Space BVSS Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 Qualified and PPAP Capable 1 These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (T = 25C unless otherwise noted) 2 A Rating Symbol Value Unit DraintoSource Voltage V 50 Vdc MARKING DSS 3 DIAGRAM GatetoSource Voltage Continuous V 20 Vdc GS Drain Current mA 1 Continuous T = 25C I 200 A D 2 J1 M Pulsed Drain Current (t 10 s) I 800 p DM SOT23 Total Power Dissipation T = 25C P 225 mW A D CASE 318 1 STYLE 21 Operating and Storage Temperature T , T 55 to 150 C J stg Range J1 = Device Code Thermal Resistance, R 556 C/W M = Date Code* JA JunctiontoAmbient = PbFree Package (Note: Microdot may be in either location) Maximum Lead Temperature for T 260 C L Soldering Purposes, for 10 seconds *Date Code orientation and/or overbar may vary depending upon manufacturing location. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ORDERING INFORMATION Device Package Shipping BSS138LT1G, SOT23 3,000 / Tape & Reel BVSS138LT1G (PbFree) BSS138LT7G SOT23 3,500 / Tape & Reel (PbFree) BSS138LT3G, SOT23 10,000 / Tape & Reel BVSS138LT3G (PbFree) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: March, 2019 Rev. 12 BSS138LT1/DBSS138L, BVSS138L ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) A Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V 50 Vdc (BR)DSS (V = 0 Vdc, I = 250 Adc) GS D Zero Gate Voltage Drain Current I Adc DSS (V = 25 Vdc, V = 0 Vdc, 25C) 0.1 DS GS (V = 50 Vdc, V = 0 Vdc, 25C) 0.5 DS GS (V = 50 Vdc, V = 0 Vdc, 150C) 5.0 DS GS GateSource Leakage Current (V = 20 Vdc, V = 0 Vdc) I 0.1 Adc GS DS GSS ON CHARACTERISTICS (Note 1) GateSource Threshold Voltage V 0.85 1.5 Vdc GS(th) (V = V , I = 1.0 mAdc) DS GS D Static DraintoSource OnResistance r DS(on) (V = 2.75 Vdc, I < 200 mAdc, T = 40C to +85C) 5.6 10 GS D A (V = 5.0 Vdc, I = 200 mAdc) 3.5 GS D Forward Transconductance g 100 mmhos fs (V = 25 Vdc, I = 200 mAdc, f = 1.0 kHz) DS D DYNAMIC CHARACTERISTICS Input Capacitance (V = 25 Vdc, V = 0, f = 1 MHz) C 40 50 pF DS GS iss Output Capacitance (V = 25 Vdc, V = 0, f = 1 MHz) C 12 25 DS GS oss Transfer Capacitance (V = 25 Vdc, V = 0, f = 1 MHz) C 3.5 5.0 DG GS rss SWITCHING CHARACTERISTICS (Note 2) ns TurnOn Delay Time t 20 d(on) (V = 30 Vdc, I = 0.2 Adc,) DD D TurnOff Delay Time t 20 d(off) Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 2. Switching characteristics are independent of operating junction temperature. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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