X-On Electronics has gained recognition as a prominent supplier of FDD86367 mosfet across the USA, India, Europe, Australia, and various other global locations. FDD86367 mosfet are a product manufactured by ON Semiconductor. We provide cost-effective solutions for mosfet, ensuring timely deliveries around the world.

FDD86367 ON Semiconductor

FDD86367 electronic component of ON Semiconductor
Images are for reference only
See Product Specifications
Part No.FDD86367
Manufacturer: ON Semiconductor
Category:MOSFET
Description: MOSFET MV7 80/20V 1000A N-chanPwrTrnchMOSFET
Datasheet: FDD86367 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.403 ea
Line Total: USD 1.4

Availability - 13293
Ships to you between
Thu. 13 Jun to Mon. 17 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2285 - WHS 1


Ships to you between
Fri. 14 Jun to Wed. 19 Jun

MOQ : 1
Multiples : 1
1 : USD 2.506
10 : USD 2.1698
30 : USD 1.961
100 : USD 1.7458
500 : USD 1.6477
1000 : USD 1.606

13058 - WHS 2


Ships to you between Thu. 13 Jun to Mon. 17 Jun

MOQ : 1
Multiples : 1
1 : USD 1.3915
10 : USD 1.288
100 : USD 1.0764
250 : USD 1.0764
500 : USD 1.035
2500 : USD 1.0338

1943 - WHS 3


Ships to you between Fri. 07 Jun to Thu. 13 Jun

MOQ : 1
Multiples : 1
1 : USD 2.301
5 : USD 2.08
10 : USD 1.677
28 : USD 1.586
500 : USD 1.534

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Qualification
Configuration
Series
Transistor Type
Brand
Cnhts
Fall Time
Hts Code
Mxhts
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Taric
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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We are delighted to provide the FDD86367 from our MOSFET category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FDD86367 and other electronic components in the MOSFET category and beyond.

MOSFET N-Channel, POWERTRENCH 80 V, 100 A, 4.2 m FDD86367 Features www.onsemi.com Typical R = 3.3 m at V = 10 V, I = 80 A DS(on) GS D Typical Q = 68 nC at V = 10 V, I = 80 A g(tot) GS D D UIS Capability This Device is PbFree, Halogen Free/BFR Free and is RoHS Compliant G Applications PowerTrain Management S Solenoid and Motor Drivers NChannel Integrated Starter/Alternator Primary Switch for 12 V Systems D G MOSFET MAXIMUM RATINGS (T = 25C unless otherwise noted) J Symbol Parameter Ratings Unit S VDSS DraintoSource Voltage 80 V DPAK3 (TO252 3 LD) VGS GatetoSource Voltage 20 V CASE 369AS I Drain Current Continuous (V = 10) 100 A D GS (Note 1) T = 25C MARKING DIAGRAM C Pulsed Drain Current T = 25C See Figure 4 C EAS Single Pulse Avalanche Energy (Note 2) 82 mJ Y&Z&3&K P Power Dissipation 227 W FDD D 86367 Derate Above 25C 1.52 W/C T , T Operating and Storage Temperature 55 to + 175 C J STG FDD86367 = Specific Device Code R Thermal Resistance, Junction to Case 0.66 C/W JC Y = ON Semiconductor Logo R Maximum Thermal Resistance, 52 C/W &Z = Assembly Plant Code JA Junction to Ambient (Note 3) &3 = 3Digit Date Code &K = 2Digits Lot Run Traceability Code Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ORDERING INFORMATION 1. Current is limited by bondwire configuration. See detailed ordering and shipping information on page 2 of 2. Starting T = 25C, L = 40 H, I = 64 A, V = 80 V during inductor charging J AS DD this data sheet. and V = 0V during time in avalanche. DD 3. R is the sum of the junction to case and case to ambient thermal JA resistance, where the case thermal reference is defined as the solder mounting surface of the drain pins. R is guaranteed by design, while R qJC JA is determined by the board design. The maximum rating presented here is 2 based on mounting on a 1 in pad of 2oz copper. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: August, 2020 Rev. 2 FDD86367/DFDD86367 PACKAGE MARKING AND ORDERING INFORMATION Device Device Marking Package Reel Size Tape Width Shipping FDD86367 FDD86367 DPAK3 (TO252 3 LD) 13 16 mm 2500 / Tape & Reel (PbFree) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Symbol Parameter Condition Min Typ Max Unit OFF CHARACTERISTICS B DraintoSource Breakdown Voltage I = 250 A, V = 0 V 80 V VDSS D GS I DraintoSource Leakage Current V = 80 V, T = 25C 1 mA DSS DS J V = 0 V GS T = 175C (Note 4) 1 mA J I GatetoSource Leakage Current V = 20 V 100 nA GSS GS ON CHARACTERISTICS V Gate to Source Threshold Voltage V = V , I = 250 A 2 3 4 V GS(th) GS DS D R Drain to Source On Resistance I = 80 A, T = 25C 3.3 4.2 m DS(on) D J V = 10 V GS T = 175C (Note 4) 6.6 8.4 m J DYNAMIC CHARACTERISTICS C Input Capacitance V = 40 V, V = 0 V, f = 1 MHz 4840 pF DS GS iss C Output Capacitance 814 pF oss C Reverse Transfer Capacitance 31 pF rss R Gate Resistance V = 0.5 V, f = 1 MHz 2.3 g GS Q Total Gate Charge V = 0 to 10 V V = 40 V, 68 88 nC g(ToT) GS DD I = 80 A D Q Threshold Gate Charge V = 0 to 2 V 8.8 nC g(th) GS Q GatetoSource Gate Charge V = 40 V, I = 80 A 22 nC gs DD D Q GatetoDrain Miller Charge 14 nC gd SWITCHING CHARACTERISTICS t TurnOn Time V = 40 V, I = 80 A, V = 10 V, 104 ns on DD D GS R = 6 GEN t TurnOn Delay 20 ns d(on) t Rise Time 49 ns r t TurnOff Delay 36 ns d(off) t Fall Time 16 ns f t TurnOff Time 80 ns off DRAINSOURCE DIODE CHARACTERISTICS V SourcetoDrain Diode Voltage I = 80 A, V = 0 V 1.3 V SD SD GS I = 40 A, V = 0 V 1.2 V SD GS t ReverseRecovery Time V = 64 V, I = 80 A, dI /dt = 100 A/ s 68 102 ns rr DD F SD Q ReverseRecovery Charge 66 106 nC rr Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. The maximum value is specified by design at T = 175C. Product is not tested to this condition in production. J www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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