MC12093 2, 4, 8 1.1 GHz Low Power Prescaler with StandBy Mode Description www.onsemi.com The MC12093 is a single modulus prescaler for low power frequency division of a 1.1 GHz high frequency input signal. MOSAIC V technology is utilized to achieve low power dissipation of 6.75 mW at a minimum supply voltage of 2.7 V. 8 On-chip output termination provides output current to drive a 2.0 pF 1 (typical) high impedance load. If additional drive is required for the SOIC8 NB DFN8 prescaler output, an external resistor can be added parallel from the D SUFFIX MN SUFFIX OUT pin to GND to increase the output power. Care must be taken not CASE 75107 CASE 506AA to exceed the maximum allowable current through the output. Divide ratio control inputs SW1 and SW2 select the required divide ratio of 2, 4, or 8. MARKING DIAGRAM Stand-By mode is featured to reduce current drain to 50 A typical 8 when the standby pin SB is switched LOW disabling the prescaler. 12093 ALYW Features 1.1 GHz Toggle Frequency 14 1 Supply Voltage 2.7 V to 5.5 Vdc SOIC8 NB DFN8 Low Power 3.0 mA Typical A = Assembly Location Operating Temperature = 40C to 85C L = Wafer Lot Divide by 2, 4 or 8 Selected by SW1 and SW2 Pins Y = Year W = Work Week On-Chip Termination = Pb-Free Package These Devices are Pb-Free, Halogen Free and are RoHS Compliant PIN CONNECTIONS Table 1. FUNCTIONAL TABLE 1 8 IN IN SW SW2 Divide Ratio V 2 7 SB CC L L 8 SW2 3 6 SW1 H L 4 4 5 Gnd OUT L H 4 (Top View) H H 2 A LOW on the Stand-By Pin 7 disables the device. 1. SW1 & SW2: H = (V 0.5 V) to V L = Open. CC CC 2. SB: H = 2.0 V to V , L = GND to 0.8 V. CC ORDERING INFORMATION IN Device Package Shipping 2 MC12093DG SOIC8 NB 98 Units/Tube (Pb-Free) MC12093DR2G SOIC8 NB 2500 Tape & Reel 4 (Pb-Free) 8 MC12093MNR4G DFN8 1000 Tape & Reel (Pb-Free) Figure 1. Function Chart Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: August, 2016 Rev. 8 MC12093/D 6B D MC12093 V = 2.7 to 5.5 V CC C3 C1 V CC IN SB SW1 50 SW2 EXTERNAL COMPONENTS IN OUT C1 = C2 = 1000 pF GND C2 C3 = 0.1 F C4 = 2.0 pF Load C4 Figure 2. AC Test Circuit Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor N/A Internal Input Pullup Resistor N/A ESD Protection Human Body Model > 4 kV Machine Model > 200 V Charged Device Model > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb-Free Pkg SOIC8 NB Level 1 DFN8 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in Transistor Count 125 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Rating Value Unit V Power Supply Voltage, Pin 2 0.5 to 6.0 Vdc CC T Operating Temperature Range 40 to 85 C A T Storage Temperature Range 65 to 150 C stg I Maximum Output Current, Pin 4 4.0 mA O Thermal Resistance (Junction-to-Case) (Note 1) DFN8 35 to 40 C/W JC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTE: ESD data available upon request. 1. JEDEC standard multilayer board 2S2P (2 signal, 2 power). For DFN8 only, thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. www.onsemi.com 2