MC74ACT241 Octal Buffer/Line Driver with 3-State Outputs The MC74ACT241 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus oriented transmitter or receiver which provides improved PC board density. www.onsemi.com Features MARKING 3State Outputs Drive Bus Lines or Buffer Memory Address DIAGRAMS Registers Outputs Source/Sink 24 mA 20 TTL Compatible Inputs ACT241 1 These are PbFree Devices AWLYYWWG SOIC20W DW SUFFIX 1 V OE YA DB YA DB YA DB YA DB CASE 751D CC 2 1 4 2 3 3 2 4 1 20 19 18 17 16 15 14 13 12 11 20 ACT 241 1 ALYW TSSOP20 DT SUFFIX 1 2 34567 8 9 10 1 CASE 948E OE DA YB DA YB DA YB DA YB GND 1 1 4 2 3 3 2 4 1 A = Assembly Location WL, L = Wafer Lot Figure 1. Pinout: 20Lead Packages Conductors YY, Y = Year (Top View) WW, W = Work Week G or = PbFree Package (Note: Microdot may be in either location) TRUTH TABLE Inputs Outputs OE D (Pins 12, 14, 16, 18) 1 ORDERING INFORMATION See detailed ordering and shipping information in the package L L L dimensions section on page 5 of this data sheet. L H H H X Z H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance TRUTH TABLE Inputs Outputs OE D (Pins 3, 5, 7, 9) 2 H L L H H H L X Z H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: February, 2015 Rev. 6 MC74ACT241/DMC74ACT241 MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage (Referenced to GND) 0.5 to +7.0 V CC V DC Input Voltage (Referenced to GND) 0.5 to V +0.5 V IN CC V DC Output Voltage (Referenced to GND) (Note 1) 0.5 to V +0.5 V OUT CC I DC Input Diode Current 20 mA IK I DC Output Diode Current 50 mA OK I DC Output Sink/Source Current 50 mA OUT I DC Supply Current, per Output Pin 50 mA CC I DC Ground Current, per Output Pin 100 mA GND T Storage Temperature Range 65 to 150 C STG T Lead temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias 140 C J Thermal Resistance (Note 2) SOIC 65.8 C/W JA TSSOP 110.7 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 30% 35% UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Model (Note 3) > 2000 V ESD Machine Model (Note 4) > 200 Charged Device Model (Note 5) > 1000 I Latchup Performance Above V and Below GND at 85 C (Note 6) 100 mA Latchup CC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. I absolute maximum rating must be observed. OUT 2. The package thermal impedance is calculated in accordance with JESD 517. 3. Tested to EIA/JESD22A114A. 4. Tested to EIA/JESD22A115A. 5. Tested to JESD22C101A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit V DC Input Voltage (Referenced to GND) 4.5 5.5 V CC V , V DC Input Voltage, Output Voltage (Referenced to GND) 0 V V IN OUT CC T Operating Temperature, All Package Types 40 25 +85 C A t , t Input Rise and Fall Time (Note 8) V = 4.5 V 0 10 10 ns/V r f CC V = 5.5 V 0 8.0 8.0 CC I Output Current High 24 mA OH I Output Current Low 24 mA OL Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 7. Unused Inputs may not be left open. All inputs must be tied to a high voltage level or low logic voltage level. 8. V from 0.8 V to 2.0 V refer to individual Data Sheets for devices that differ from the typical input rise and fall times. in www.onsemi.com 2