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MM74HCT540, Inverting Octal 3-STATE Buffer MM74HCT541, Octal 3-STATE Buffer June 2007 MM74HCT540, Inverting Octal 3-STATE Buffer tm MM74HCT541, Octal 3-STATE Buffer Features General Description TTL input compatible The MM74HCT540 and MM74HCT541 3-STATE buffers utilize advanced silicon-gate CMOS technology and are Typical propagation delay: 12ns general purpose high speed inverting and non-inverting 3-STATE outputs for connection to system buses buffers. They possess high drive current outputs which Low quiescent current: 80A enable high speed operation even when driving large Output current: 6mA (Min.) bus capacitances. These circuits achieve speeds com- parable to low power Schottky devices, while retaining the low power consumption of CMOS. Both devices are TTL input compatible and have a fanout of 15 LS-TTL equivalent inputs. MM74HCT devices are intended to interface between TTL and NMOS components and standard CMOS devices. These parts are also plug-in replacements for LS-TTL devices and can be used to reduce power con- sumption in existing designs. The MM74HCT540 is an inverting buffer and the MM74HCT541 is a non-inverting buffer. The 3-STATE control gate operates as a two-input NOR such that if either G1 or G2 are HIGH, all eight outputs are in the high-impedance state. In order to enhance PC board layout, the MM74HCT540 and MM74HCT541 offers a pinout having inputs and outputs on opposite sides of the package. All inputs are protected from damage due to static discharge by diodes to V and ground. CC Ordering Information Package Order Number Number Package Description MM74HCT540WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide MM74HCT540SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT540MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT541WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide MM74HCT541SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT541MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT541N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide Devices also available in Tape and Reel. Specify by appending the suffix letter X to the ordering number. 1984 Fairchild Semiconductor Corporation www.fairchildsemi.com MM74HCT540, MM74HCT541 Rev. 1.3