N24RF16 Dual Interface RFID 16 Kb EEPROM Tag ISO 15693 RF 2 and I C Bus Compliant Description The N24RF16 is a RFID/NFC tag with a 16 Kb EEPROM device, www.onsemi.com offering both contactless and contact interface. In addition to the ISO/IEC 15693 radio frequency identification (RFID) interface 2 protocol, the device features an I C interface to communicate with 2 amicrocontroller. The I C contact interface requires an external SOIC 8 TSSOP8, 4.4x3 power supply. CASE 751BD CASE 948AL The 16 Kb EEPROM array is internally organized as 512 x 32 bits in 2 RF mode and as 2048 x 8 bits when accessed from the I C interface. PIN CONFIGURATION Features A V 0 CC Contactless Transmission of Data AN 1 A 1 ISO 15693 / ISO 180003 Mode1 Compliant AN SCL 2 Vicinity Range Communication (up to 150 cm) V SDA SS Air Interface Communication at 13.56 MHz (HF) To tag: ASK Modulation with 1.65 Kbit/s or 26.48 Kbit/s Data SOIC (W, X), TSSOP (Y) Rate From Tag: Load Modulation Using Manchester Coding with PIN FUNCTION 423 kHz and 484 kHz Subcarriers in Low (6.6 Kbit/s) or high Pin Name Function (26 Kbit/s) Data Rate Mode. Supports the 53 Kbit/s Data Rate A0, A1 Device Address with Fast Commands SDA Serial Data Read & Write 32bit Block Mode SCL Serial Clock Anticollision Support AN1, AN2 Antenna Coil Security: V Power Supply 64bit Unique Identifier (UID) CC Multiple 32bit Passwords and Lock Feature for Each User V Ground SS Memory Sector 2 Supports Fast (400 kHz) and FastPlus (1 MHz) I C Protocol MARKING DIAGRAMS 1.8 V to 5.5 V Supply Voltage Range 4Byte Page Write Buffer X X 2 I C Timeout AYMZZZ AYMZZZ 2 Schmitt Triggers and Noise Suppression Filters on I C Bus Inputs (SCL and SDA) 512Blocks x 32 Bits (16 Sectors of 32 Blocks Each): RF Mode X = Specific Device Code 2 A = Assembly Site Code 2048 x 8 Bits I C Mode Y = Production Year (Last Digit) 2,000,000 Program/Erase Cycles M = Production Month Code ZZZ = Last 3 Characters of Assembly Lot Number 200 Year Data Retention 40 C to +105 C Temperature Range ORDERING INFORMATION SOIC, TSSOP 8lead Packages See detailed ordering and shipping information on page 21 of These Devices are PbFree, Halogen Free/BFR Free and are RoHS this data sheet. Compliant* *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: November, 2018 Rev. 1 N24RF16/DN24RF16 V CC AN1 SCL AN2 SDA N24RF16 A0, A1 V SS Figure 1. Functional Symbol Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Rating Unit C Storage Temperature 65 to +150 Ambient Operating Temperature -40 to +105 C 0.5 to 6.5 V Voltage on SCL, SDA, A0, A1 and V pins with respect to Ground (Note 1) CC 28 RF Input Voltage Peak to Peak Amplitude between AN1 and AN2, VSS pad floating V -1 to 15 AC Voltage on AN1 or AN2 with respect to GND V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. During transitions, the voltage undershoot on any pin should not exceed 1 V for more than 20 ns. Voltage overshoot on the SCL and SDA 2 I C pins should not exceed the absolute maximum ratings, irrespective of VCC. Table 2. RELIABILITY CHARACTERISTICS EEPROM (Note 2) Symbol Parameter Test Conditions Max Unit NEND Endurance T 25 C, 1.8 V < V < 5.5 V 2,000,000 A CC Write Cycles (Note 3) T = 85 C, 1.8 V < V < 5.5 V 800,000 A CC T = 105 C, 1.8 V < V < 5.5 V 300,000 A CC TDR Data Retention T = 25 C 200 Year A 2. Determined through qualification/characterization. 3. A Write Cycle refers to writing a Byte or a Page. www.onsemi.com 2