DATA SHEET www.onsemi.com TinyLogic ULP-A Dual Buffer MARKING DIAGRAMS (Open-Drain Output) CCKK SIP6 1.45X1.0 XYZ NC7WV07 MicroPak CASE 127EB The NC7WV07 is a dual buffer with opendrain output in tiny Pin 1 = footprint packages. The device is designed to operate for V 0.9 V CC to 3.6 V. CC = Specific Device Code KK = 2Digit Lot Run Traceability Code Features XY = 2Digit Date Code Z = Assembly Plant Code Designed for 0.9 V to 3.6 V V Operation CC 1.6 ns t at 3.3 V (Typ) PD 6 Inputs/Outputs OverVoltage Tolerant up to 3.6 V XXXM SC88 I Supports Partial Power Down Protection OFF CASE 419B02 Source/Sink 24 mA at 3.3 V 1 1 Available in SC88 and MicroPak Packages These Devices are PbFree, Halogen Free/BFR Free and are RoHS XXX = Specific Devic Code Compliant M = Date Code* = PbFree Package (Note: Microdot may be in either location) A 1 6 Y A1 1 6Y1 1 1 *Date Code orientation and/or position may vary depending upon manufacturing location. GND 2 5 V GND 2 5V CC CC A 3 4 Y ORDERING INFORMATION 2 2 A2 3 4Y2 See detailed ordering, marking and shipping information on page 6 of this data sheet. MicroPak SC88 Figure 1. Pinout Diagrams (Top Views) 1 A Y 1 1 1 A Y 2 2 Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin Function A Input Y Output 1 A1 L L 2 GND H Z 3 A2 Z = High Impedance 4 Y2 5 V CC 6 Y1 Semiconductor Components Industries, LLC, 2006 1 Publication Order Number: September, 2021 Rev. 2 NC7WV07/DNC7WV07 MAXIMUM RATINGS Symbol Characteristics Value Unit V DC Supply Voltage 0.5 to +4.3 V CC V DC Input Voltage 0.5 to +4.3 V IN V DC Output Voltage ActiveMode (High or Low State) 0.5 to V + 0.5 V OUT CC TriState Mode (Note 1) 0.5 to +4.3 PowerDown Mode (V = 0 V) 0.5 to +4.3 CC I DC Input Diode Current V < GND 50 mA IK IN I DC Output Diode Current V < GND 50 mA OK OUT I DC Output Source/Sink Current 50 mA OUT I or I DC Supply Current per Supply Pin or Ground Pin 50 mA CC GND T Storage Temperature Range 65 to +150 C STG T Lead Temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias +150 C J Thermal Resistance (Note 2) SC88 377 C/W JA MicroPak 154 P Power Dissipation in Still Air SC88 332 mW D MicroPak 812 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in R V ESD Withstand Voltage (Note 3) Human Body Model 4000 V ESD Charged Device Model 2000 I Latchup Performance (Note 4) 100 mA Latchup Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tristated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2 ounce copper trace no air flow per JESD517. 3. HBM tested to EIA / JESD22A114A. CDM tested to JESD22C101A. JEDEC recommends that ESD qualification to EIA/JESD22A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II. www.onsemi.com 2