NCP186 LDO Regulator - Fast Transient Response Low Voltage 1 A The NCP186x series are CMOS LDO regulators featuring 1 A www.onsemi.com output current. The input voltage is as low as 1.8 V and the output voltage can be set from 0.8 V. MARKING Features DIAGRAMS Operating Input Voltage Range: 1.8 V to 5.5 V XDFN8 Output Voltage Range: 0.8 to 3.9 V XXM MX SUFFIX Fixed or Adjustable Output Voltage Applications CASE 711AS Quiescent Current typ. 90 A XX = Specific Device Code M = Date Code Low Dropout: 100 mV typ. at 1 A, V = 3.0 V OUT = PbFree Package High Output Voltage Accuracy 1% (Note: Microdot may be in either location) Stable with Small 1 F Ceramic Capacitors Overcurrent Protection XXXXXX DFN12 XXXXXX Builtin Soft Start Circuit to Suppress Inrush Current MU SUFFIX ALYW CASE 506CE Thermal Shutdown Protection: 165C 1 With (NCP186A) and Without (NCP186B) Output Discharge XXXXXX = Specific Device Code Function A = Assembly Location Available in XDFN8 1.2x1.6mm & DFN12 4x4mm Packages L = Wafer Lot Y = Year These Devices are PbFree, Halogen Free/BFR Free and are RoHS W = Work Week Compliant = PbFree Package Typical Applications (Note: Microdot may be in either location) Battery Powered Equipment Portable Communication Equipment PIN CONNECTIONS Cameras, Image Sensors and Camcorders IN OUT 1 8 Fixed Output Voltage Application OUT 2 7 IN OUT=0.8V VIN V IN OUT CIN COUT N/C 3 6 EN 1 F NCP186 0.8V 1 F ON FB/ EN GND 4 5 GND ADJ FB/ADJ OFF (Top View) Adjustable Output Voltage Application OUTADJ=1.2V VIN V N/C 1 12 N/C IN OUT CIN COUT R1 C1 2 11 IN NCP186 0.8V OUT 1 F1 F 5k1 1 nF ON 0.8V FB/ 3 10 EN OUT IN GND ADJ OFF R2 4 9 N/C EN 10k 5 8 FB/ADJ GND R R 6 7 N/C N/C 1 1 V V 1 0.8 1 OUT ADJ OUTNOM R R 2 2 (Top View) Set I , I in range from 10 A to 100 A R1 R2 Figure 1. Typical Application Schematic ORDERING INFORMATION This document contains information on some products that are still under development. ON Semiconductor reserves the right to change or discontinue these products without See detailed ordering and shipping information on page 12 of notice. this data sheet. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: September, 2019 Rev. 6 NCP186/DNCP186 IN OUT IN OUT PROG. VOLTAGE PROG. VOLTAGE REFERENCE AND REFERENCE AND SOFTSTART SOFTSTART FB/ADJ FB/ADJ EN EN 0.7 V 0.7 V THERMAL THERMAL GND GND SHUTDOWN SHUTDOWN NCP186A (with output active discharge) NCP186B (without output active discharge) Figure 2. Internal Block Diagram Table 1. PIN FUNCTION DESCRIPTION Pin No. Pin No. Pin XDFN8 DFN12 Name Description 1, 2 2, 3 OUT LDO output pin 3 1,4,6,7,12 N/C Tune the space here, this line is not horizontally aligned with others. Not internally connected. This pin can be tied to the ground plane to improve thermal dissipation. 4 5 FB/ADJ Feedback / adjustable input pin (connect this pin directly to the OUT pin or to the resistor di- vider) 5 8 GND Ground pin 6 9 EN Chip enable input pin (active H) 7, 8 10, 11 IN Power supply input pin EPAD EPAD EPAD Its recommended to connect the EPAD to GND, but leaving it open is also acceptable Table 2. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) IN 0.3 to 6.0 V Output Voltage OUT 0.3 to V + 0.3 V IN Chip Enable Input EN 0.3 to 6.0 V Output Current I Internally Limited mA OUT Maximum Junction Temperature T 150 C J(MAX) Storage Temperature T 55 to 150 C STG ESD Capability, Human Body Model (Note 2) ESD 2000 V HBM ESD Capability, Charged Device Model (Note 2) ESD 1000 V CDM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114) ESD Charged Device Model tested per JS0022014 Latchup Current Maximum Rating tested per JEDEC standard: JESD78 Table 3. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance, JunctiontoAir, XDFN8 1.2 mm x 1.6 mm (Note 3) 111 C/W R JA Thermal Resistance, JunctiontoAir, DFN12 4 mm x 4 mm (Note 3) R 44 C/W JA 3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51 7. www.onsemi.com 2