NCP571MN08TBG ON Semiconductor

NCP571, NCV571 Voltage Regulator - CMOS, Low Iq, Low Output 150 mA The NCP571 series of fixed output low dropout linear regulators are NCP571, NCV571 PIN CONNECTIONS TSOP5 package DFN6 package V 1 5 V V 1 6 V in out out in GND 2 NC 2 EP 5 NC Enable GND 3 4 3 4 NC Enable (Top View) (Top View) PIN FUNCTION DESCRIPTION DFN6 TSOP5 Pin Name Description 1 5 V Regulated output voltage. out 2 4 NC No Internal Connection. It is recommended to connect this pin to GND potential. 3 2 GND Power supply ground. 4 3 Enable This input is used to place the device into low power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable pin should be connected to V . in 5 NC No Internal Connection. It is recommended to connect this pin to GND potential. 6 1 V Positive power supply input voltage. in EP EP No Internal Connection. It is recommended to connect this pin to GND potential. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage V 0 to 12 V in Enable Voltage V 0.3 to V + 0.3 V EN in Output Voltage V 0.3 to V + 0.3 V out in Power Dissipation P Internally Limited W D Operating Junction Temperature T +150 C J Operating Ambient Temperature NCP571 T 40 to +85 C A NCV571 40 to +125 Storage Temperature T 55 to +150 C stg ESD Capability, Human Body Model (Note 1) ESD 2000 V HBM ESD Capability, Machine Mode (Note 1) ESD 200 V MM ESD Capability, Charged Device Model (Note 1) ESD 1000 V CDM Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114) ESD Machine Model tested per AECQ100003 (EIA/JESD22A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model (Jedec Standard) 2. Latchup capability (85C) 100 mA DC with trigger voltage. THERMAL CHARACTERISTICS Rating Symbol Test Conditions Typical Value Unit 2 JunctiontoAmbient TSOP5 R 1 oz Copper Thickness, 100 mm 250 C/W JA 2 PSIJLead 2 TSOP5 1 oz Copper Thickness, 100 mm 68 C/W J L2 2 JunctiontoAmbient DFN6 R 1 oz Copper Thickness, 100 mm 190 C/W JA 2 PSIJLead 2 DFN6 1 oz Copper Thickness, 100 mm 84 C/W J L2 NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 511, 2, 3, 7, 12.