Product Information

NCP693HMN12TCG

NCP693HMN12TCG electronic component of ON Semiconductor

Datasheet
LDO Regulator Pos 1.2V 1A 6-Pin UDFN EP T/R

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5000: USD 0.8077 ea
Line Total: USD 4038.5

0 - Global Stock
MOQ: 5000  Multiples: 5000
Pack Size: 5000
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 5000
Multiples : 5000

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NCP693HMN12TCG
ON Semiconductor

5000 : USD 0.8077

     
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NCP693 1A CMOS Low-Dropout Voltage Regulator The NCP693 series of fixed output low dropout linear regulators are designed for portable battery powered applications with high output current requirement up to 1 A. Each device contains a voltage NCP693 Vin Vout Vin Vout Vin Vin Vout Vout Vref Vref Current Limit & Current Limit & Thermal Shutdown Thermal Shutdown CE CE GND GND Version H (NCP693HMNxxTCG) Version D (NCP693DMNxxTCG) Figure 1. Internal Block Diagram PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 V Regulated output voltage. out 2 V Regulated output voltage. out 3 GND Power supply ground. 4 CE This input is used to place the device into low power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to V . in 5 V Positive power supply input voltage. in 6 V Positive power supply input voltage. in EP GND Power supply ground. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage V 7 V in Enable Voltage V 0.3 to V V CE in Output Voltage V 0.3 to V + 0.3 V out in Operating Junction Temperature T +150 C J Operating Ambient Temperature T 40 to +85 C A Storage Temperature T 55 to +125 C stg Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per (JEDEC 22A114 B) Machine Model Method 200 V THERMAL CHARACTERISTICS Rating Symbol Test Conditions Typical Value Unit 2 Junction toAmbient R 1 oz Copper Thickness, 100 mm 114 C/W JA 2 PSIJLead 2 1 oz Copper Thickness, 100 mm 25 C/W J L2 Power Dissipation P 880 mW D NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 511, 2, 3, 7, 12.

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Aptina / ON Semiconductor
FAIRCHILD
FAIRCHILD (ON SEMICONDUCTOR)
Fairchild Semiconductor
FS8
FSC
ON
ON SEMI
ON Semicon
ON SEMICONDUCTOR
ON SEMICONDUCTOR (FAIRCHILD)
ON Semiconductor / Fairchild
ON4
ON5
onsemi
ON-SEMI
onsemi / Fairchild
OOF
Xsens / Fairchild

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