DATA SHEET www.onsemi.com Positive Voltage Regulators 100 mA MC78L00A Series, 1 NCV78L00A 1 2 2 3 3 The MC78L00A Series of positive voltage regulators are STRAIGHT LEAD BENT LEAD inexpensive, easytouse devices suitable for a multitude of TO92 Pin: 1. Output applications that require a regulated supply of up to 100 mA. Like 2. Ground P SUFFIX their higher powered MC7800 and MC78M00 Series cousins, these 3. Input CASE 2910 regulators feature internal current limiting and thermal shutdown making them remarkably rugged. No external components are required with the MC78L00 devices in many applications. These devices offer a substantial performance advantage over the traditional zener dioderesistor combination, as output impedance SOIC8* and quiescent current are substantially reduced. D SUFFIX SOT89 CASE 751 CASE 528AG Features *SOIC8 is an internally modified SO8 package. Pins Wide Range of Available, Fixed Output Voltages 2, 3, 6, and 7 are electrically common to the die attach Low Cost flag. This internal lead frame modification decreases package thermal resistance and increases power Internal Short Circuit Current Limiting dissipation capability when appropriately mounted on Internal Thermal Overload Protection a printed circuit board. SOIC 8 conforms to all ex- ternal dimensions of the standard SO8 package. No External Components Required Complementary Negative Regulators Offered (MC79L00A Series) PIN CONNECTIONS NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ100 18 V V OUT IN Qualified and PPAP Capable 2 7 GND GND These are PbFree Devices GND 3 6 GND NC 4 5 NC Input Q5 Q11 Q3 (Top View) 15k TAB Q12 Q1 Q10 5.0k 3.0 Output 3.8k 12 3 Q4 Q6 0-25k V GND V OUT IN (Top View) 1.9k 19k 2.2k 1.2k Q9 C ORDERING INFORMATION Q8 See detailed ordering and shipping information in the package Q2 Z1 2.85k dimensions section on page 9 of this data sheet. Q7 420 DEVICE MARKING INFORMATION 1.0k Ground See general marking information in the device marking section on page 12 of this data sheet. Figure 1. Representative Schematic Diagram Semiconductor Components Industries, LLC, 1999 1 Publication Order Number: August, 2021 Rev. 20 MC78L00A/DMC78L00A Series, NCV78L00A MC78LXXA Input Output C * in C ** O 0.33 F 0.1 F Figure 2. Standard Application A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output voltage even during the low point on the input ripple voltage. * C is required if regulator is located an appreciable distance from power supply filter. in ** C is not needed for stability however, it does improve transient response. O ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (5.0 V9.0 V) V 30 Vdc I Input Voltage (12 V18 V) 35 Input Voltage (24 V) 40 Storage Temperature Range T 65 to +150 C stg Maximum Junction Temperature T 150 C J Moisture Sensitivity Level MSL 1 ESD Capability, Human Body Model (Note 1) ESD 2000 V HBM ESD Capability, Machine Model (Note 1) ESD 200 V MM ESD Capability, Charged Device Model (Note 1) ESD 2000 V CDM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114) ESD Machine Model tested per AECQ100003 (EIA/JESD22A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model. THERMAL CHARACTERISTICS Rating Symbol Value Unit Package Dissipation PD Internally Limited W Thermal Characteristics, TO92 R 200 C/W JA Thermal Resistance, JunctiontoAmbient Thermal Characteristics, SOIC8 R Refer to Figure 8 C/W JA Thermal Resistance, JunctiontoAmbient Thermal Characteristics, SOT89 R 55 C/W JA Thermal Resistance, JunctiontoAmbient 2. Thermal Resistance, JunctiontoAmbient depends on P.C.B. Copper area. See details in Figure 8. Thermal Resistance, JunctiontoCase is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board. www.onsemi.com 2