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MOSFET Power, Single, N-Channel 40 V, 7.3 m , 51 A NTTFS5C466NL Features www.onsemi.com Small Footprint (3.3 x 3.3 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) Low Capacitance to Minimize Driver Losses V R MAX I MAX (BR)DSS DS(on) D These Devices are PbFree and are RoHS Compliant 7.3 m 10 V 40 V 51 A MAXIMUM RATINGS (T = 25C unless otherwise noted) J 12 m 4.5 V Parameter Symbol Value Unit DraintoSource Voltage V 40 V DSS NChannel GatetoSource Voltage V 20 V GS D (5 8) Continuous Drain T = 25C I 51 A C D Current R JC T = 100C 36 (Notes 1, 2, 3, 4) C Steady State Power Dissipation T = 25C P 38 W C D G (4) R (Notes 1, 2, 3) JC T = 100C 19 C Continuous Drain T = 25C I 14 A A D S (1, 2, 3) Current R JA T = 100C 12 (Notes 1, 3, 4) A Steady State Power Dissipation T = 25C P 3.1 W A D MARKING DIAGRAM R (Notes 1, 3) JA T = 100C 2.1 1 A 1 S D Pulsed Drain Current T = 25C, t = 10 s I 200 A DM A p 466L WDFN8 S D AYWW S D Operating Junction and Storage Temperature T , T 55 to C ( 8FL) J stg Range +175 G D CASE 511AB Source Current (Body Diode) I 10 A S 466L = Specific Device Code Single Pulse DraintoSource Avalanche E 72 mJ AS A = Assembly Location Energy (I = 3 A) L(pk) Y = Year WW = Work Week Lead Temperature for Soldering Purposes T 260 C L = PbFree Package (1/8 from case for 10 s) Stresses exceeding those listed in the Maximum Ratings table may damage the (Note: Microdot may be in either location) device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ORDERING INFORMATION THERMAL RESISTANCE MAXIMUM RATINGS (Note 1) See detailed ordering, marking and shipping information in the Parameter Symbol Value Unit package dimensions section on page 5 of this data sheet. JunctiontoCase Steady State (Note 3) R 3.5 C/W JC JunctiontoAmbient Steady State (Note 3) R 48 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2. Psi ( ) is used as required per JESD51 12 for packages in which substantially less than 100% of the heat flows to single case surface. 2 3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 4. Continuous DC current rating. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: September, 2019 Rev. 4 NTTFS5C466NL/D