MURHS160T3G, NRVUHS160VT3G, SURHS8160T3G 600 V, 1 A Power Rectifier Features and Benefits www.onsemi.com Ultrafast 35 Nanosecond Recovery Times 175C Operating Junction Temperature ULTRAFAST RECTIFIER High Temperature Glass Passivated Junction 1.0 AMPERES High Voltage Capability to 600 V 600 VOLTS NRVUHS and SURHS8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 Qualified and PPAP Capable These Devices are PbFree and are RoHS Compliant* Applications SMB Power Supplies CASE 403A PLASTIC Inverters Free Wheeling Diodes 1 2 Mechanical Characteristics Case: Epoxy, Molded MARKING DIAGRAM Epoxy Meets UL 94 V0 0.125 in Weight: 95 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal ALYWW Leads are Readily Solderable UH16 Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds Cathode Polarity Band UH16 = Specific Device Code AL = Assembly Location Y = Year MAXIMUM RATINGS WW = Work Week Rating Symbol Value Unit = PbFree Package (Note: Microdot may be in either location) Peak Repetitive Reverse Voltage V 600 V RRM Working Peak Reverse Voltage V RWM DC Blocking Voltage V R Average Rectified Forward Current I A F(AV) ORDERING INFORMATION (Rated V , T = 145C) 1.0 R L Device Package Shipping Nonrepetitive Peak Surge Current I A FSM (Surge Applied at Rated Load Conditions 15 MURHS160T3G SMB 2,500 / Halfwave, Single Phase, 60 Hz) (PbFree) Tape & Reel Operating Junction and Storage T , T 65 to +175 C J stg NRVUHS160VT3G SMB 2,500 / Temperature Range (PbFree) Tape & Reel ESD Ratings: V Machine Model = C > 400 SURHS8160T3G SMB 2,500 / Human Body Model = 3B > 8000 (PbFree) Tape & Reel Stresses exceeding those listed in the Maximum Ratings table may damage the For information on tape and reel specifications, device. If any of these limits are exceeded, device functionality should not be including part orientation and tape sizes, please assumed, damage may occur and reliability may be affected. refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: October, 2016 Rev. 4 MURHS160/DMURHS160T3G, NRVUHS160VT3G, SURHS8160T3G THERMAL CHARACTERISTICS Rating Symbol Value Unit Maximum Thermal Resistance, JunctiontoLead (Note 1) R 24 C/W JL Maximum Thermal Resistance, JunctiontoAmbient (Note 2) R 80 C/W JA 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. ELECTRICAL CHARACTERISTICS Rating Symbol Typ Max Unit Maximum Instantaneous Forward Voltage (Note 3) V V F (I = 1.0 A, T = 25C) 1.5 2.4 F C (I = 1.0 A, T = 125C) 1.2 1.7 F C Maximum Instantaneous Reverse Current (Note 3) I A R (Rated dc Voltage, T = 25C) 0.18 20 C (Rated dc Voltage, T = 125C) 5.0 200 C Maximum Reverse Recovery Time t ns rr (I = 1.0 A, di/dt = 50 A/ s) 25 35 F (I = 0.5 A, I = 1.0 A, I = 0.25 A) 16 30 F R REC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width = 300 s, Duty Cycle 2.0%. www.onsemi.com 2